Basic Steps for CANFD Debugging

Basic Steps for CANFD Debugging

CAN (Controller Area Network) is a serial communication network that effectively supports distributed control or real-time control. The CAN bus is a widely adopted bus protocol in automotive applications, designed for microcontroller communication in automotive environments. As company projects gradually shift towards the automotive sector, the scenarios for using CAN are increasing. This article analyzes … Read more

Chip Foundry and Wafer Certification: Six Companies Directly Benefiting

Chip Foundry and Wafer Certification: Six Companies Directly Benefiting

The new policy issued by the China Semiconductor Industry Association on April 11, 2025, shifts the integrated circuit origin certification standard from “packaging location” to “wafer fabrication location.” This change will accelerate the migration of global chip companies’ wafer fabrication processes to mainland China. As a critical validation step between chip R&D and mass production, … Read more

Can x86 and ARM Maintain Their Dominance? Not Likely! Domestic RISC-V Chips Aim to Capture the Automotive Market!

Can x86 and ARM Maintain Their Dominance? Not Likely! Domestic RISC-V Chips Aim to Capture the Automotive Market!

The core components of the computers and smartphones we use every day are the chip instruction sets: Intel’s x86 and ARM. The former occupies over 90% of the computer market, while the latter dominates over 95% of the smartphone market.This situation is frustrating, but suddenly, something called RISC-V has emerged, which does not require licensing … Read more

Texas Instruments: Price Ranges and Proportions of Automotive Power Management Chips

Texas Instruments: Price Ranges and Proportions of Automotive Power Management Chips

The following is a further analysis of the price ranges of different types of power management chips based on search results, including the proportion of chips in each price range: Power Management – Automotive LED Drivers Low Price Range (0-10 CNY): Includes LM3406HV-Q1 (6.401 CNY), LM3406-Q1 (5.214 CNY), LM3421-Q1 (9.638 CNY), etc., accounting for approximately … Read more

Texas Instruments: Automotive Grade Chips Priced Over 100 Yuan

Texas Instruments: Automotive Grade Chips Priced Over 100 Yuan

These chips are primarily used in the automotive field and can be categorized based on their functions and features into types such as System on Chip (SoC), Analog-to-Digital Converters (ADC), Digital Signal Processors (DSP), Microcontrollers (MCU), Radar Sensors, Clock Jitter Cleaners, Analog Front Ends, and Digital Micromirror Device (DMD) Controllers: System on Chip (SoC) Used … Read more

Titan: A 3D Printer Supporting Hundreds of Granular and Filament Materials with Integrated Additive and Subtractive Manufacturing

Titan: A 3D Printer Supporting Hundreds of Granular and Filament Materials with Integrated Additive and Subtractive Manufacturing

Introduction by Antarctic Bear: Many people think of FDM 3D printers as those machines that print ordinary plastics on a desktop, but in reality, FDM extrusion technology can create many groundbreaking devices. Today, let’s explore a “open-source granular material extrusion technology that combines additive and traditional subtractive manufacturing” marvel. Introducing the new Titan 3D printer … Read more

How Flex and BMW Address ECU Validation Challenges

How Flex and BMW Address ECU Validation Challenges

BMW F48 (Image source: BMW Group website) Electronic Control Unit (ECU) certification is the future of connected vehicles—Flex and the BMW Group overcome this challenge based on Catena-X data exchange. The Engine Control Unit (ECU), also known as DME (Digital Motor Electronics) or DDE (Digital Diesel Electronics), is a critical component in automotive manufacturing. From … Read more

From -196°C to 600°C: A New Alloy Pushes the Limits of Metal Materials

From -196°C to 600°C: A New Alloy Pushes the Limits of Metal Materials

On April 18, scientists from Pohang University of Science and Technology (POSTECH) achieved a significant breakthrough in materials science by successfully developing a new type of nickel-based high-entropy alloy (High-Entropy Alloy, HEA). This alloy can maintain excellent strength and toughness across an extreme temperature range from -196°C to 600°C. Traditional metals often lose stability when … Read more

The Reluctant Revival: Japan’s Semiconductor Industry in the Last Decade

The Reluctant Revival: Japan's Semiconductor Industry in the Last Decade

This article is from the WeChat public account:Yuan Chuan Research Institute (ID: caijingyanjiu), Author: He Luheng, Cover image from: Visual China In August 2022, eight Japanese companies, including Toyota, Sony, Kioxia, and NEC, jointly established the new national semiconductor team, Rapidus. The Japanese government generously provided a subsidy of 70 billion yen. The Latin meaning … Read more

Development of Scalable IoT Applications: Demonstration Role of Smart Connected Vehicles

Development of Scalable IoT Applications: Demonstration Role of Smart Connected Vehicles

Source: Telenor IoTIoT Think Tank ReprintAutomakers, like other businesses or consumers, expect vehicles to remain seamlessly connected at all times.No matter which market the vehicle is launched in, or where the user drives, automakers hope that once the connectivity service is activated, the network operator can ensure that the vehicle remains connected.Ensuring seamless connectivity for … Read more