Embedded Software & Tools

  • Operating Systems (Linux, RTOS, Android)
  • Firmware Development
  • Embedded Security
  • Development Tools & IDEs
  • AI/ML in Embedded Systems

Advancements in GaN Technology II: The First 100nm High-Performance GaN Wafer PDK Platform in China

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Advancements in GaN Technology II: The First 100nm High-Performance GaN Wafer PDK Platform in China

Jiufengshan Laboratory GaN PDK R&D Team Jiufengshan Laboratory GaN Series Achievements II Recently, Jiufengshan Laboratory released the first 100 nm silicon-based GaN commercial Process Design Kit (PDK) in China, with performance indicators reaching domestic leading and international top levels. As the second commercial solution globally and the first in China, its technical specifications support high-throughput … Read more

New Breakthrough! Zhuhai Company Successfully Tapes Out Its First Ultra-Performance AI Chip with Integrated Storage and Computing

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New Breakthrough! Zhuhai Company Successfully Tapes Out Its First Ultra-Performance AI Chip with Integrated Storage and Computing

Recently, Zhuhai High-tech Zone high-tech enterprise Zhuhai Haoze Technology Co., Ltd. (referred to as “Haoze Technology”), has made significant progress in edge intelligent technology, and its self-developed first ultra-performance integrated storage and computing AI chip VVT300 has successfully taped out. This groundbreaking achievement opens up new avenues for the commercial application of its AI chips. … Read more

Technical Insights from Silicon Carbide Wafer Manufacturers: A Comprehensive Analysis of Hybrid Bonding

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Technical Insights from Silicon Carbide Wafer Manufacturers: A Comprehensive Analysis of Hybrid Bonding

Introduction to Senhui: Suzhou Senhui Semiconductor, supported by a strong research and technical team, focuses on providing complete process solutions and wafer services for global compound semiconductor customers. The team members have deep experience in the semiconductor industry, with decades of rich capabilities in photolithography, thin film processes, epitaxy, bonding processes, as well as etching, … Read more

What is the NRE Stage of MEMS Wafer Fabrication? What is the Relationship Between MPW and NRE?

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What is the NRE Stage of MEMS Wafer Fabrication? What is the Relationship Between MPW and NRE?

Source: Chip Learning Original Author: Chip Future The semiconductor wafer fabrication NRE refers to “Non-Recurring Engineering” costs, which are one-time expenses incurred during the chip development process. These costs cover a series of non-recurring work from chip design to the successful first wafer fabrication, including design and R&D expenses, mask production costs, process development and … Read more

Causes of Chip Tape-Out Failures

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Causes of Chip Tape-Out Failures

Recently, while chatting with a prominent figure in the industry, we discussed the topic of chip tape-out failures. I found this to be quite an interesting subject, so I gathered some reasons for chip tape-out failures online and would like to share them here. 1. Incorrect version of the design was used. This issue is … Read more

Optimization Design of Vertical Interconnect Transition Structures for Microwave Circuit Boards

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Optimization Design of Vertical Interconnect Transition Structures for Microwave Circuit Boards

In modern high-frequency microwave circuit design, vertical interconnect transition structures serve as critical paths for signal transmission between different layers of PCBs, and their performance directly affects the overall properties of the system. As communication systems advance into the millimeter-wave frequency band, traditional via structures can no longer meet the integrity requirements for high-frequency signals. … Read more

Dynamic Bending Radius Calculation and Validation of Flexible Printed Circuits

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Dynamic Bending Radius Calculation and Validation of Flexible Printed Circuits

Dynamic Bending Radius Calculation and Validation of Flexible Printed CircuitsIn modern electronic product design, Flexible Printed Circuits (FPC) are widely used in wearable devices, medical electronics, automotive electronics, and aerospace due to their lightweight, foldable, and bendable characteristics. However, during the design of FPCs, dynamic bending is a crucial factor that must be accurately calculated … Read more

RF Circuit Board Design Techniques

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RF Circuit Board Design Techniques

In modern electronic systems, the design of Radio Frequency (RF) circuit boards has become increasingly complex and critical. With the rapid development of communication technologies, from 5G mobile communications to satellite communications and radar systems, the performance of RF circuits directly affects the quality and reliability of the entire system. The design of RF circuit … Read more

Composition, Design, Process, Workflow, and Principles of Component Placement and Routing for PCB Circuit Boards

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Composition, Design, Process, Workflow, and Principles of Component Placement and Routing for PCB Circuit Boards

Let’s learn about the composition, design, process, workflow, and principles of component placement and routing for PCB circuit boards, along with some considerations for the later stages! Composition of PCB Circuit Boards 1. Lines and Planes: The lines serve as the conductive paths between components, and a large copper area is designed separately for grounding … Read more

Top 10 Automotive Grade MCU Chips Preferred by Chinese Engineers

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Top 10 Automotive Grade MCU Chips Preferred by Chinese Engineers

According to authoritative market research institutions, the global MCU market size is expected to reach approximately $17.79 billion in 2020, with shipments exceeding 28 billion units. This year’s MCU market size is projected to reach $18.48 billion, with a compound annual growth rate (CAGR) of 10.1% from 2021 to 2028, growing to $36.16 billion by … Read more