Board Overview

TES807 is a dualFMC interface signal processing platform based on Gigabit or 10 Gigabit Ethernet transmission. This platform utilizesXILINX‘sKintex UltraScale seriesFPGA:XCKU115-2FLVF1924I as the main processor. The FPGA is equipped with two sets of 72 bit DDR4 SDRAM for achieving ultra-large capacity data caching. The maximum data cache bandwidth of DDR4 can reach 2400MHz, and the total cache capacity of DDR4 is 32GByte.

The FPGA is equipped with 2 FMC+ interfaces, each FMC+ interface supports 16 channels of high-speed GTH serial buses. Each FMC+ interface supports 84 LVDS data interfaces, and the two FMC+ interfaces together support 168 LVDS interfaces, allowing for external data access.

The FPGA is equipped with 1 QSFP+ fiber interface, supporting 4Gbps real-time transmission rates. The board also supports one Gigabit Ethernet interface for command and control transmission. The board has a J30J debugging interface for controlling peripherals. This board is suitable for signal processing that requires Gigabit or 10 Gigabit Ethernet transmission.

Technical Specifications

1. Supports 1 high-performance FPGA:XCKU115-2FLVF1924I:

• System Logic Units:1451K;

• CLB LUTs:663360;

• Maximum Distributed RAM (Kb):18360;

• Maximum BlockRAM/FIFO (36Kb each):2160;

• DSP Units:5520;

2. Dynamic Cache Performance:

• Dynamic Cache: Supports 2 groups DDR4 SDRAM;

• Width per group:72 bits;

• Capacity per group:16GByte, total32GByte;

• Operating Frequency:2400M data rate;

3. External Interface Performance:

• Supports 1 QSFP+ fiber interface, supporting line rate 10Gbps/lane;

• Fiber interface supports 10G 10 Gigabit Ethernet data transmission;

• Supports 1 RJ45 Gigabit Ethernet interface;

4. Other Interfaces:

• Supports 1 RS422 interface;

• Supports 16 GPIO interfaces;

5. Physical and Electrical Characteristics:

• Board Size:160 x 160mm

• Board Power Supply:4A max@+12V (±5%);

• Cooling Method: Natural air cooling

6. Environmental Characteristics:

• Operating Temperature:-40°~﹢85°C;

• Storage Temperature:-55°~﹢125°C;

• Operating Humidity:5%~95%, non-condensing

Software Support:

1. Integrated board-level software development package (BSP):

2. Provides drivers for various underlying interfaces;

3. Provides software integration based on various interfaces;

4. Custom algorithms and system integration can be provided according to customer needs:

Application Scope:

1. Radar signal processing;

2. Video image processing;