In the PCB industry, whether conducting technical reviews, reading design documents, or managing production processes, the ability to proficiently interpret professional abbreviations is a prerequisite for efficient communication and collaboration.
To facilitate reference and consultation, we have compiled a list of core terms from design, materials, manufacturing to testing, creating this Quick Reference Guide to Abbreviations in the PCB Industry.
💡 Design & Software
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PCB (Printed Circuit Board (Bare Board)) – Printed Circuit Board (Bare Board)
Definition: A printed circuit board is a support structure for electronic components and provides electrical connections.
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PCBA (Printed Circuit Board Assembly) – Printed Circuit Board Assembly
Definition: Refers to a printed circuit board assembly that has completed the installation and soldering of all electronic components (such as chips, resistors, capacitors, connectors, etc.) and has undergone necessary testing.
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CAD (Computer Aided Design) – Computer Aided Design
Definition: Refers to the use of computer software for PCB layout and routing design.
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CAM (Computer Aided Manufacturing) – Computer Aided Manufacturing
Definition: Receives CAD design files to generate the necessary data and instructions for the actual production of PCBs.
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CID/CID+ (Certified Interconnect Designer) – Certified Interconnect Designer (Junior/Senior)
Definition: IPC-issued certification for PCB designers, representing professional competency levels.
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JEDEC (Joint Electron Device Engineering Council) – Joint Electron Device Engineering Council
Definition: An authoritative industry organization that establishes standards for microelectronic device packaging, testing, and more.
🔧 Processes & Materials
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BGA (Ball Grid Array) – Ball Grid Array
Definition: A high-density packaging technology that arranges solder balls in an array format at the bottom of the package.
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QFN (Quad Flatpack – No Lead) – Quad Flatpack – No Lead
Definition: A surface mount package that is flat on all four sides and has no leads, with solderable thermal pads on the bottom.
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BTC (Bottom Termination Component) – Bottom Termination Component
Definition: Refers to all packages with solder terminals located at the bottom of the component, such as QFN, BGA, etc.
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CSP (Chip Scale Package) – Chip Scale Package
Definition: A small package whose size does not exceed 1.2 times the chip size.
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LCC / LCCC (Leadless Chip Carrier) – Leadless Chip Carrier
Definition: A leadless ceramic package that relies on solder pads on the sides of the package for soldering.
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Td (Laminate Temperature of Decomposition) – Laminate Temperature of Decomposition
Definition: The temperature point at which resin decomposition begins to occur. Td is typically defined as the temperature point corresponding to a 5% loss of original mass during decomposition.
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Tg (Glass Transition Temperature) – Glass Transition Temperature
Definition: The critical temperature at which substrate material transitions from a rigid state to a rubbery state; the higher the temperature, the better the heat resistance.
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CTE (Coefficient of Thermal Expansion) – Coefficient of Thermal Expansion
Definition: The degree to which a material expands or contracts in size with temperature changes.
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Dk (Dielectric Constant) – Dielectric Constant
Definition: An indicator that measures the ability of substrate material to store electrical energy, affecting signal transmission speed.
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CAF (Conductive Anodic Filament) – Conductive Anodic Filament
Definition: A conductive filament of copper ions that grows inside the PCB under the influence of an electric field and moisture, which may lead to short circuits.
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MSL (Moisture Sensitivity Level) – Moisture Sensitivity Level
Definition: Indicates the sensitivity of components to moisture in the environment, determining the usable time limit after unsealing.
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PSL (Process Sensitivity Level) – Process Sensitivity Level
Definition: Used to quantify the sensitivity of the component to process variations and fluctuations during assembly (soldering).
📋 Management & Standards
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BOM (Bill of Materials) – Bill of Materials
Definition: A detailed and structured list of all materials required for a product, which is a core document for production and procurement.
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RoHS (Restriction of Hazardous Substances) – Restriction of Hazardous Substances Directive
Definition: EU legislation that restricts the use of specific hazardous substances (such as Pb) in electronic and electrical equipment.
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CE (Conformité Européenne) – European Conformity (according to EU directives)
Definition: A mark indicating that a product complies with relevant safety, health, and environmental standards of the EU.
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UL (Underwriters Laboratories Inc.) – Underwriters Laboratories Inc.
Definition: An authoritative organization in the United States engaged in safety standards and certification.
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CIS/CIT (Certified IPC Specialist / Trainer) – IPC Application Specialist / Certified Trainer
Definition: Qualification for IPC standards (Acceptability of Electronic Assemblies) application specialists and certified trainers.
✅ Testing & Quality
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ICT (In-Circuit Test) – In-Circuit Test
Definition: Tests the installation, soldering, and connection of components on the PCBA by contacting test points through a probe bed.
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FCT (Functional Circuit Test) – Functional Test
Definition: Simulates the final working environment of the board to verify whether its overall functionality meets design expectations.
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HIPOT (High Potential Test) – High Voltage Test
Definition: A test that applies high voltage to check the insulation strength of the product and the safety distance between conductors.
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ESD (Electrostatic Discharge) – Electrostatic Discharge
Definition: The sudden release of static electricity, which is an “invisible killer” for precision electronic components.
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EMC (Electromagnetic Compatibility) – Electromagnetic Compatibility
Definition: The ability of a device to operate normally in its electromagnetic environment without causing unacceptable electromagnetic interference to other devices.
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FPY (First Pass Yield) – First Pass Yield
Definition: The ratio of products that pass the first test, an important indicator of production line capability and quality.
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DPM/DPMO (Defect Per Million / Per Million Opportunities) – Defects Per Million
Definition: A statistical unit that measures process quality; DPMO considers the complexity of the process, making it more precise.
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UUT (Unit Under Test) – Unit Under Test
Definition: Refers to the board or product being tested.
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