Goodbye Serial Testing! Siemens Tessent IJTAG Pro Breaks the 3D IC Testing Dilemma
Abstract “A 3D chip the size of a fingernail contains hundreds of billions of transistors, but the number of ‘pins’ to test it may be fewer than that of an old SIM card!” This statement left a deep impression on me during a recent conversation with semiconductor engineers. As chip design transitions from 2D to … Read more