Experimental Research on Chip Embedded Manifold Microchannel Heat Sink (Series Work Review)
01 Research Background The integration and computational speed of chips are rapidly increasing, leading to a sharp rise in energy consumption and heat generation density. Efficient heat dissipation technology has become a critical technological bottleneck restricting the development of high-performance chips. Microchannel heat sinks, with their high integration and heat dissipation density, have emerged as … Read more