Introduction AI computing power has become the core productivity in the digital economy era, but the global AI industry is facing three major challenges: “insufficient supply, high costs, and an ecosystem yet to be built.” According to industry statistics, the average utilization rate of computing resources in the industry is only 30% to 40%, leading … Read more
1. IntroductionPower optimization for FPGAs is a systematic project that requires collaborative optimization from multiple levels including design architecture, RTL code, tool configuration, and physical implementation, while balancing performance, area, and power consumption (PPA). For Zynq/MPSoC, which also includes the PS side, there are more factors to consider and more methods to apply. For example, … Read more
The standard design process that PCB (Printed Circuit Board) engineers must master is crucial for ensuring the performance, reliability, and manufacturability of circuit boards. Below is a phased outline of the standard design process and its core points: 1. Requirement Analysis and Preliminary Preparation Clarify Design Objectives Define circuit functions and performance indicators (such as … Read more
Source: China IDC Circle Recently, Microsoft Chairman and CEO Satya Nadella announced on social media that the Microsoft team has achieved a significant breakthrough: a new liquid cooling method using microfluidic technology, which opens the door to more efficient, sustainable, and denser data centers compared to traditional methods. This is a liquid cooling technology that … Read more
Click to receive a free sample coupon~ In the field of electronic manufacturing, PCBs serve as the “nervous system” of electronic products, and the quality of their design directly determines the performance and reliability of the products. However, some seemingly reasonable PCB designs may hide fatal flaws, becoming time bombs for product failure. This article … Read more
Structure and Thermal Design of New Energy Vehicle System Modules (IP67 Reliability Improvement Method) How to Quickly Master a Technology Through Learning (The “Craftsman Program” 1.0 for Digital R&D of Structure and Thermal Design Has Officially Launched!) How to Conduct Electronic Product R&D? Solidworks Structural Design Spiral Water Channel Cold Plate & FloEFD Thermal Flow … Read more
1. Power Connector Design Standards Electrical Clearance and Creepage Distance The electrical clearance between the power and protective ground (PGND) should be ≥2mm, and the creepage distance should be ≥2mm (before the fuse) or ≥1.4mm (after the fuse). The distance between PGND and other signals (such as GND, low-speed signals) should be ≥2mm, and the … Read more
Safety Distance Requirements This includes electrical clearance (air gap), creepage distance (surface distance), and insulation penetration distance. 1. Electrical clearance: The shortest distance measured along the air between two adjacent conductors or between a conductor and the surface of an adjacent motor casing. 2. Creepage distance: The shortest distance measured along the insulating surface between … Read more
In the era of smart cars, the smoothness of the in-car system has become one of the important factors for consumers when purchasing a vehicle. One of the core hardware components that determine the in-car experience is the automotive-grade chip – the Qualcomm 8155. As a mainstream high-performance automotive chip, the 8155 is widely used … Read more
The Xiangteng NPU chip HKN201 neural network processor is a domestically produced, high-performance, multi-core processor designed for strong real-time, high-performance, and high-concurrency application scenarios by Xi’an Xiangteng Microelectronics Technology Co., Ltd.The hardware design of the HKN201 neural network processor core board requires reference documents including the hardware design guide, core board hardware schematic reference, schematic … Read more