Thermal Design

Xiangteng NPU Chip (4) – Core Board Hardware Design Reference Materials Summary

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Xiangteng NPU Chip (4) - Core Board Hardware Design Reference Materials Summary

The Xiangteng NPU chip HKN201 neural network processor is a domestically produced, high-performance, multi-core processor designed for strong real-time, high-performance, and high-concurrency application scenarios by Xi’an Xiangteng Microelectronics Technology Co., Ltd.The hardware design of the HKN201 neural network processor core board requires reference documents including the hardware design guide, core board hardware schematic reference, schematic … Read more

Xiangteng NPU Chip – Core Board Hardware Design Reference Materials Compilation

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Xiangteng NPU Chip - Core Board Hardware Design Reference Materials Compilation

The Xiangteng NPU chip HKN201 neural network processor is a domestically produced, high-performance, multi-core processor designed for strong real-time, high-performance, and high-concurrency application scenarios by Xi’an Xiangteng Microelectronics Technology Co., Ltd.The hardware design reference documents for the HKN201 neural network processor core board include the hardware design guide, core board hardware schematic reference, schematic design … Read more

Surface Flatness Requirements for Gold Bonding Areas on Microwave Circuit Boards

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Surface Flatness Requirements for Gold Bonding Areas on Microwave Circuit Boards

PCB Thermal Design: A Comprehensive Analysis from Theory to Practice Thermal issues are often the “Achilles’ heel” of many electronic products, especially in modern PCB designs with high integration and high power consumption. I remember a project I took on last year for an industrial control board, where the main chip had a power consumption … Read more