Chip Packaging: SIP vs SOC

Click the above“Mechanical and Electronic Engineering Technology” to follow us In the rapid development of electronic technology, chip packaging technology plays a crucial role. Today, we will explore two mainstream chip packaging technologies: SIP (System in Package) and SOC (System on Chip). These two technologies play a key role in the miniaturization, efficiency, and integration … Read more

Differences Between SoC and SIP (System in Package)

Source: Tom Talks Chips Original Author: Tom This article introduces the differences between SoC and SIP, along with their advantages and disadvantages. What Are SoC and SIP? SoC (System on a Chip) is essentially an integrated circuit that integrates all functions such as the central processing unit, input and output ports, internal memory, power management … Read more

From System on Chip (SoC) to Cubic Integrated Circuit (CIC)

Source: SiP and Advanced Packaging Technology Original Author: Suny Li The design concepts of chips have evolved from SoC to SoIC and then to CIC. This article introduces the differences among these three. SoC (System on Chip), SoIC (System on Integrated Chip), and CIC (Cubic Integrated Circuit) – what are their similarities and differences? Today, … Read more

How Inflammation Promotes Atherosclerosis: The Key Steps

▎Content Team of WuXi AppTec Edited Lipid accumulation and hypertension are considered major risk factors for atherosclerotic cardiovascular disease (ASCVD). Cholesterol-lowering and antihypertensive medications are expected to effectively prevent and eliminate ASCVD. However, intervention strategies based on hypercholesterolemia and hypertension have failed to produce ideal results due to the exclusion of chronic vascular inflammation. The … Read more

Automotive Grade Chip IC Levels and Their Characteristics

Recommendation: GSAuto Alliance | Three Electric Technology Expert Committee Initially, it is only for personnel involved in the research, management, and manufacturing of three electric systems in new energy vehicles from OEMs, Tier 1 companies, universities and research institutions. Currently, we have recruited over 490 people, mainly distributed across more than 50 OEMs, 50+ Tier … Read more

AAPM 263 Standardized Naming for Radiation Therapy Structures

“The Late Spring Festival”! In 2020, as the Mid-Autumn Festival coincided with National Day, each person’s feelings and reflections on the tumultuous past six months and the sense of loss and recovery are countless. As families reunite, let us together remember the past and cherish the present! The National Day holiday is already halfway through. … Read more

Solution for No Cortex-M Device Found in JTAG Chain

Today I flashed a firmware, and it ran normally. However, when I tried to flash another firmware, I encountered this issue: No Cortex-M Device found in JTAG chain.Please check the JTAG cable and the connected devices. I found the answer on Baidu, which indicated that treating the JTAG pins as I/O pins would cause the … Read more

Understanding A64, ARMv8, ARMv9, and AArch64 Architectures

Thought: A64 refers to the instruction set architecture, aarch64 is the 64-bit architecture, armv8/armv9 are also architectures, Trustzone is a type of security architecture, they are all architectures, confused? What is arm64? 1. armv7/armv8/armv9 are the real architectures of ARM. The term architecture can be understood as a technical specification, a technical reference, a design, … Read more

How Powerful Is MediaTek’s Dimensity 1380 with 3.0GHz and 4 A78 Cores?

Click the above PC Enthusiasts to follow us At the end of last year, Qualcomm tailored the Snapdragon 8cx Gen3 computing platform for “Windows on ARM”, which uses a 5nm process and consists of 4 cores of 3.0GHz Cortex-X1 super large cores and 4 cores of 2.4GHz Cortex-A78 large cores. Compared to the previous generation, … Read more

Dimensity 900: A Strong Mid-Range Challenger

Click on the top PC Enthusiasts to follow us Yesterday, MediaTek officially announced the latest member of the Dimensity family – the Dimensity 900. Its arrival is expected to fill the market gap between the Dimensity 1000 series and the Dimensity 800 series, and it will engage in fierce competition with Qualcomm’s Snapdragon 780G level … Read more