Advanced Semiconductor Packaging Technology

Advanced Semiconductor Packaging Technology

Currently, there are five confirmed growth engines in the semiconductor industry, which are:① Mobile terminals, such as smartphones, smartwatches, wearable devices, laptops, and tablets;② High-performance computing (HPC), also known as supercomputing, which can process data and perform complex calculations at high speeds on supercomputers;③ Autonomous vehicles;④ Internet of Things (IoT), such as smart factories and … Read more

Advanced Packaging Technology in Semiconductors

Advanced Packaging Technology in Semiconductors

The current semiconductor industry has five confirmed growth engines, which are:① Mobile terminals, such as smartphones, smartwatches, wearable devices, laptops, and tablets;② High-performance computing (HPC), also known as supercomputing, which can process data and perform complex calculations at high speeds on supercomputers;③ Autonomous vehicles;④ The Internet of Things (IoT), such as smart factories and smart … Read more

Differences Between SoC and SIP (System in Package)

Differences Between SoC and SIP (System in Package)

Source: Tom Talks Chips Original Author: Tom This article introduces the differences between SoC and SIP, along with their advantages and disadvantages. What Are SoC and SIP? SoC (System on a Chip) is essentially an integrated circuit that integrates all functions such as the central processing unit, input and output ports, internal memory, power management … Read more

Wang Ningning Discusses: How Packaging Substrate Integration Technology Reshapes the Power Industry

Wang Ningning Discusses: How Packaging Substrate Integration Technology Reshapes the Power Industry

“ The power system is undergoing transformation, with magnetic integration technology becoming a key breakthrough point? Professor Wang Ningning shared at the academic annual meeting how the new packaging substrate integration technology will lead the innovation of power technology. Author | Chen Zexiang Cover | Electronic Transformer and Inductor Network At the 11th Joint Academic … Read more