Differences Between SoC and SIP (System in Package)

Differences Between SoC and SIP (System in Package)

Source: Tom Talks Chips Original Author: Tom This article introduces the differences between SoC and SIP, along with their advantages and disadvantages. What Are SoC and SIP? SoC (System on a Chip) is essentially an integrated circuit that integrates all functions such as the central processing unit, input and output ports, internal memory, power management … Read more

Wang Ningning Discusses: How Packaging Substrate Integration Technology Reshapes the Power Industry

Wang Ningning Discusses: How Packaging Substrate Integration Technology Reshapes the Power Industry

“ The power system is undergoing transformation, with magnetic integration technology becoming a key breakthrough point? Professor Wang Ningning shared at the academic annual meeting how the new packaging substrate integration technology will lead the innovation of power technology. Author | Chen Zexiang Cover | Electronic Transformer and Inductor Network At the 11th Joint Academic … Read more