Assistance with 1.4nm Chip Flexible Substrate Technology

1. SiO₂ nanoparticle doping rate (5-20wt%)
2. Nanocellulose diameter (10-15nm)
3. Metal oxide layer thickness (0.5-2nm)
4. Organic-inorganic hybrid interface density (10³/cm²)
Micro composition (10 items)	5. Ultra-thin silicon layer lattice defect density (<10⁵/cm²)
6. Flexible polymer chain orientation (>80%)
7. Nanowire conductive network porosity (5-30%)
8. Stress buffer layer Young’s modulus (0.1-5GPa)
9. Surface roughness (Ra<0.5nm)
10. Coefficient of thermal expansion (CTE 0.1-5ppm/K)
Macro composition (10 items)	1. Multi-layer flexible packaging structure (PI/BCB/PET)
2. Ultra-thin silicon-based chip thinning layer (<1.4nm)
3. Nano-imprinted patterned conductive layer
4. Biodegradable paper substrate (transmittance >85%)
5. Strain-isolated serpentine interconnect structure
6. Stretchable microfluidic channel network
7. Flexible antenna integrated module (<1GHz bandwidth)
8. Self-healing polymer coating (repair rate >90%)
9. Thermal management phase change material layer (thermal conductivity >3W/mK)
10. Multi-modal sensor array (density >100/cm²)
Function (10 items)	1. Reduce interface thermal stress (ΔT<50℃)
2. Enhance ductility (>200%)
3. Suppress crack propagation (critical strain >5%)
4. Improve electrical signal transmission stability (impedance fluctuation <5%)
5. Optimize thermal expansion matching (CTE difference <2ppm/K)
6. Increase transmittance (visible light range >90%)
7. Achieve biocompatibility (cell survival rate >95%)
8. Support high-frequency signal transmission (loss <0.1dB/mm)
9. Dynamic stress self-adaptive adjustment (response time <1ms)
10. Extend cycle life (>10⁵ bends)
Location (10 items)	1. Chip-substrate interface layer
2. Stress buffer transition zone
3. Conductive interconnect topology network
4. Packaging protective outer layer
5. Thermal management functional interlayer
6. Sensor integration surface
7. Wireless communication module embedded layer
8. Biological tissue contact surface
9. Environmental response smart coating
10. Energy harvesting unit integration area
Value (10 items)	1. Reduce manufacturing costs (30% lower than silicon-based processes)
2. Increase device density (integration +50%)
3. Promote commercialization of wearable medical devices
4. Achieve breakthroughs in electronic skin human-computer interaction
5. Accelerate deployment of IoT edge computing
6. Break through traditional chip mechanical performance limits
7. Support heterogeneous integration (compatible with 5 types of materials)
8. Reduce electronic waste (biodegradation rate >80%)
9. Improve energy efficiency (power consumption reduced by 40%)
10. Open up flexible electronics applications in space
Significance (10 items)	1. Break through the physical limits of Moore’s Law
2. Promote iteration of flexible display technology (folding radius <1mm)
3. Achieve long-term implantation stability of brain-machine interfaces
4. Solve the mechanical mismatch problem in human-computer interaction
5. Promote sustainable development of green electronics
6. Build ubiquitous sensing IoT infrastructure
7. Support miniaturization of AI terminal devices
8. Innovate real-time monitoring patterns in medical diagnostics
9. Promote lightweight design in aerospace
10. Open a new era of wearable devices in the metaverse