Inphi is a leader in high-speed data movement interconnects, dedicated to rapidly transferring large data sets globally, between data centers and within data centers. We have adopted Tempus ECO and Tempus Signoff across all advanced process node projects. Due to the large scale of the designs, we chose to run flattened static timing analysis (STA) … Read more
Recently, the Loongson 2K3000 (3B6000M) has completed preliminary functionality and performance assessments, with all indicators meeting expectations. The Loongson 2K3000 and Loongson 3B6000M are different packaging versions based on the same silicon wafer, targeting industrial control applications and mobile terminal fields, respectively.The chip integrates 8 LA364E processor cores, achieving a measured SPEC CPU 2006 Base … Read more
On June 2, according to data from Siemens Electronic Design Automation (EDA) tools, the success rate of first tape-out for chip designs has dropped to a historic low of 14%, a significant decrease from 24% two years ago. This means that eight out of ten chip design companies will encounter failure during their first tape-out. … Read more
This article contains 8284 words, estimated reading time is 21 minutes. · Abstract ·With the acceleration of digital transformation and the exponential increase in the complexity of cyber threats, security operation models are gradually shifting from single-product defenses and rule-driven approaches to a data-driven and AI-empowered intelligent defense era. Major cybersecurity vendors have launched their … Read more
With the significant improvement in the processing capabilities of communication devices, whether designing computer systems, next-generation semiconductor products, or communication systems, RF engineers must cope with increasingly higher signal rates. To enable high-speed devices to process data more efficiently, they have tirelessly invented technologies that can increase external bus bandwidth, allowing for the transmission of … Read more
Printed Circuit Boards (PCBs) are critical electronic interconnect components used in nearly all electronic products. They are indispensable electronic components in modern electronic information products, often referred to as the “mother of electronic products.” The global market size is expected to exceed $70 billion by 2024. Copper clad laminates (CCLs), one of the highest cost … Read more
On the weekend of May 18, I had arranged to visit the Sichuan Fine Arts Institute with companions to see an art exhibition.When we arrived, we learned that the graduate exhibition had just concluded, and we were left empty-handed.However, fate seems to enjoy playing little tricks on us, as if unexpectedly granting us surprises—the teacher’s … Read more
1. Company Fundamentals: Performance Reversal Imminent, Valuation at Historical Low 1. Financial Data Overview Oshkosh (002913) achieved a revenue of 4.566 billion yuan in 2024 (up 5.45% year-on-year), but the net profit attributable to shareholders decreased by 31.88% to 353 million yuan due to rising raw material prices, exchange rate fluctuations, and initial production costs … Read more
Driven by applications in artificial intelligence, servers and data storage, network communication, and automotive electronics, the global PCB industry has entered a new growth cycle, with the market size expected to reach $100 billion by 2030. Open-source large models like DeepSeek have significantly reduced deployment costs and barriers across various industries, leading to a rapid … Read more
Core Themes and Important Facts: This patent document details anintelligent manufacturing process for Printed Circuit Boards (PCBs), aimed at addressing issues such as labor shortages, high labor costs, low production efficiency, and defect rates in traditional production by enhancing automation, intelligence, informatization, and digitization, ultimately achievingfully automated production, intelligent control, digital presentation, and real-time information … Read more