Year: 2025

Democratizing 3D Integration: A Low-Cost Prototyping Solution Based on Chip-Level Thinning, Through-Silicon Vias (TSV), and Meta Bonding

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Democratizing 3D Integration: A Low-Cost Prototyping Solution Based on Chip-Level Thinning, Through-Silicon Vias (TSV), and Meta Bonding

Original link: https://xplorestaging.ieee.org/document/11007580【Abstract】 Three-dimensional integrated circuit (3D-IC) technology, with its vertical interconnections through silicon vias (TSV), has become central to advanced semiconductor devices. However, the initial development costs are prohibitively high, primarily due to the substantial investment required for wafer-level TSV processes. This study proposes…

Testing Automotive-Grade Chips: Technical Challenges and Future Opportunities in the Domestic Market

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Testing Automotive-Grade Chips: Technical Challenges and Future Opportunities in the Domestic Market

Introduction: Why are Automotive-Grade Chips So Important?Driven by the wave of intelligence and electrification, automobiles have evolved from traditional mechanical products into “smart terminals” that heavily rely on electronic control systems. The core of this transformation is the automotive-grade chips.Automotive-grade chips differ from consumer-grade or industrial-grade chips; they must meet the stringent requirements for reliability, … Read more

Voice of Ruichuang: A Comprehensive Breakdown of the SAW Wafer Fabrication Process (Part 2 – Thin Film Etching)

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Voice of Ruichuang: A Comprehensive Breakdown of the SAW Wafer Fabrication Process (Part 2 - Thin Film Etching)

Have you discovered the options for “Share” and “Like”? Click here to check it out. Last Issue Review From 0 to 1: A Comprehensive Breakdown of the SAW Wafer Fabrication Process (Part 1 – Photolithography) Reshaping the Body – Thin Film Deposition While beautiful appearances are commonplace, interesting souls are rare. In the life spectrum … Read more

Services | AMF Silicon-Based Photonic Chip Wafer Fabrication (2025)

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Services | AMF Silicon-Based Photonic Chip Wafer Fabrication (2025)

2025/06/20, Advanced Photonics Advanced Micro Foundry (AMF) is a silicon-based photonics specialized fabrication line located in Singapore. AMF provides highly innovative and reliable silicon photonic manufacturing solutions for cutting-edge application areas such as optical communication, optoelectronic sensing, optical ranging, and optoelectronic computing. The silicon photonic product manufacturing services offered by AMF are user-demand driven, with … Read more

Key Elements of PCBA Pre-Production Review and Hengtianyi’s Standardized Practices

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Key Elements of PCBA Pre-Production Review and Hengtianyi's Standardized Practices

Core Competitiveness of Flexible Response and Fast Delivery“Click the blue text to follow us”2023 PCBA (Printed Circuit Board Assembly) is a core aspect of modern electronic manufacturing, and its quality directly affects the performance and reliability of the final product. In the PCBA production process, the pre-production review is a crucial preparatory work that not … Read more

Essential Guide to PCBA Appearance Inspection Training Materials

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Essential Guide to PCBA Appearance Inspection Training Materials

[Image][Image]Introduction: PCB is a fundamental electronic material in PCBA processing, and any PCBA processing cannot be separated from PCB. How should PCBA circuit boards be accepted, and what acceptance standards need to be noted? How are these acceptance standards assessed? This article covers the basics of IPC-A-610, the operation of electronic components, component installation, basic … Read more

Key Considerations for Material Substitution in PCBA Manufacturing

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Key Considerations for Material Substitution in PCBA Manufacturing

Core Competitiveness of Flexible Response and Fast Delivery“Click the blue text to follow us”2023 In the manufacturing process of PCBA (Printed Circuit Board Assembly), material substitution is a critical step that directly affects the performance, quality, and reliability of the final product. Taking Hengtian Yi Electronics Co., Ltd. as an example, it has accumulated rich … Read more

Printed Circuit Boards (PCBs): The Fastest Growing Companies

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Printed Circuit Boards (PCBs): The Fastest Growing Companies

Since the beginning of 2025, the commercialization of edge artificial intelligence applications has significantly accelerated, with products like AI smartphones and AIPC rapidly increasing their market penetration. Fields such as smart cars, robotics, wearable devices, and smart homes are also fully advancing towards AI upgrades.In this industrial development trend, the upstream hardware sector has first … Read more

Optimizing Airflow Organization to Enhance Cleanliness in PCB Clean Rooms

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Optimizing Airflow Organization to Enhance Cleanliness in PCB Clean Rooms

Enhancing cleanliness in PCB clean rooms through optimized airflow organization can be approached from the following key aspects: 1. Reasonable Planning of Airflow Direction and Area Division Unidirectional or Mixed Flow Mode: Implementing vertical unidirectional flow or horizontal unidirectional flow modes allows clean air to flow from clean areas to contaminated areas, carrying pollutants out … Read more

Unit 3: Voids in Coating Layers Inside PCB Holes

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Unit 3: Voids in Coating Layers Inside PCB Holes

During visual inspection (non-sectioning), voids in the copper layer and coating layer of the hole (void) are common defects. Voids identified during visual inspection refer to areas exposing the substrate material, while voids identified through section analysis refer to areas below the minimum thickness specification, indicating a fundamental difference between the two. Different grades of … Read more