Recently, industry insiders reported that TSMC will start mass production of 5nm chips in April, with initial capacity fully booked by customers. The major customers include Apple’s A14 (to be used in this fall’s new iPhone) and HiSilicon’s new generation Kirin processors (for Huawei’s flagship devices). Now there are some new updates regarding Kirin. According … Read more
Taiwan Semiconductor Manufacturing Company (TSMC) has officially announced that it has begun mass production of the 7nm N7+ process. This marks TSMC’s first, and the industry’s first, mass production using EUV (Extreme Ultraviolet) lithography technology, which is of great significance and puts it ahead of Intel and Samsung by a significant margin. TSMC stated that … Read more
Source: CITIC Securities Research Department, Electronic Industry Research Group. Original title: “[CITIC Electronics] Commentary on the Upgrade of US Restrictions on Huawei,” with edits. Abstract: CITIC Electronics believes that Huawei has achieved significant self-research in chip design, but the manufacturing stage remains a major bottleneck. Domestic semiconductors will be forced to grow rapidly, especially in … Read more
Industry Highlights ICVIEWS+ Successful Tape-Out of Loongson 2K3000 (3B6000M) ProcessorRecently, Loongson Technology announced the successful tape-out of the Loongson 2K3000 (3B6000M) processor. The Loongson 2K3000 (3B6000M) has completed preliminary functionality and performance assessments, with all indicators meeting expectations. The Loongson 2K3000 and Loongson 3B6000M are different packaging versions based on the same silicon wafer, targeting … Read more
The world’s first 3nm chip has been born, surprisingly not led by TSMC, sparking heated discussions in the tech community. Will TSMC’s dominant position in technology face its final chapter? According to relevant media reports, Samsung’s fully wrapped gate 3nm chip has officially debuted. As the first company to break the industry’s technological ceiling, Samsung … Read more
👆If you wish to meet often, feel free to star 🌟 and bookmark it! Source: Content from the Economic Daily, thank you. The market went wild yesterday (6th) with rumors that the Trump administration has initiated a “humanitarian corridor” for tariffs, releasing key provisions of the exemption clause “9903.01.34”. Products with over 20% U.S. value … Read more
Today, we must discuss this matter thoroughly! It’s not a new issue, but the nauseating feeling can be sensed through the screen! TSMC and Samsung have once again started to pledge loyalty to their “American daddy”!How do they show loyalty? By throwing money! A lot of money! TSMC is even more ruthless, increasing its investment … Read more
1. TSMC’s “Americanization”: From Technology Transfer to Mass Migration Recently, TSMC announced an additional investment of $100 billion in the United States, combined with a previous plan of $65 billion, bringing the total to $165 billion, setting a record for the largest foreign investment in U.S. history. This substantial amount will be used to build … Read more
On April 2, GUC Creative Electronics, a Taiwanese chip service company with over one-third ownership by TSMC, announced the successful tape-out of the world’s first HBM4 IP (including controller and PHY physical layer) using TSMC’s advanced N3P process and CoWoS-R advanced packaging. GUC’s HBM4 IP supports data transfer rates of up to 12Gbps. Compared to … Read more
Process Node Process Type Technical Features 2nm Logic, Nanosheet (0.75V, shrink) Utilizes nanosheet technology with a 0.75V operating voltage and shrink characteristics, which helps improve chip integration and performance. 3nm Logic, Fin FET (0.75/1.2V, shrink)Logic, Fin FET (0.75/1.2V, Non-shrink) Based on Fin Field Effect Transistor technology, it offers different voltage combinations (0.75/1.2V) with both shrink … Read more