90% of USB drives are modules, which are composed of chips and surrounding components, such as PCB capacitors and resistors. Why do we have products like modules? For example, CPUs and MCUs can be directly soldered onto the motherboard. This represents a direct relationship between the chip and the motherboard, but many products cannot be … Read more
1. Application Layer The application layer is the first layer of the TCP/IP protocol, directly providing services to application processes. (Data unit: message) It supports the World Wide Web with HTTP, email with SMTP, and file transfer with the FTP protocol. 2. Transport Layer Responsible for providing general data transmission services for communication between processes … Read more
On April 2, GUC Creative Electronics, a Taiwanese chip service company with over one-third ownership by TSMC, announced the successful tape-out of the world’s first HBM4 IP (including controller and PHY physical layer) using TSMC’s advanced N3P process and CoWoS-R advanced packaging. GUC’s HBM4 IP supports data transfer rates of up to 12Gbps. Compared to … Read more
A smartphone, a computer, a new energy vehicle, or even a smart refrigerator—what is the “brain” behind them? The answer lies within a space the size of a fingernail—chips. From daily life to aerospace technology, chips serve as the “invisible cornerstone” of modern society, yet they are rarely truly understood. Today, we will unveil the … Read more
How 14nm Chips Outperform 5nm: Disassembly of Huawei’s New Smartphone Reveals the Path for Domestic Chips In recent years, the global chip industry has seen intense competition. Against the backdrop of the U.S. technology blockade on China, Huawei has achieved a turnaround from “14nm chips” to “high-end smartphone chips” through self-developed technology breakthroughs and integration … Read more