GUC Creative Electronics Announces Successful Tape-Out of the World’s First HBM4 IP

On April 2, GUC Creative Electronics, a Taiwanese chip service company with over one-third ownership by TSMC, announced the successful tape-out of the world’s first HBM4 IP (including controller and PHY physical layer) using TSMC’s advanced N3P process and CoWoS-R advanced packaging.

GUC’s HBM4 IP supports data transfer rates of up to 12Gbps. Compared to HBM PHY, the successful tape-out of HBM4 PHY achieved a 2.5 times increase in bandwidth, improved power efficiency by 1.5 times, and doubled area efficiency, with significant PPA improvements.

GUC Creative Electronics Announces Successful Tape-Out of the World's First HBM4 IP

GUC stated that the company optimized the performance of HBM4 IP in terms of signal integrity and power integrity through innovative interlayer layout design, ensuring that HBM4 can operate stably in high-speed mode under various CoWoS technologies.

GUC’s HBM4 IP also integrates interconnect monitoring circuits provided by Israeli company proteanTecs, which offer observability of HBM online signals and electrical characteristic analysis, further enhancing the actual operational efficiency and reliability of end products.

GUC’s General Manager, Dai Shangyi, stated:

We are proud to be the first company in the world to successfully tape out a 12Gbps HBM4 controller and PHY IP. We will continue to commit to providing industry-leading 2.5D / 3D IP and services. By integrating HBM4, UCIe-A, and UCIe-3D IP, we provide comprehensive solutions for the semiconductor industry to meet the evolving market demands.

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