Intel’s Advanced Packaging: The Technical Force Behind Efficient Integration of AI Chips
In the wave of AI development, a technology is stepping from the “backstage” to the “forefront”: advanced packaging in semiconductors. This technology enables the integration of chiplets with different functions, processes, sizes, and manufacturers within a single device, creating system-on-chip (SoC) solutions in a flexible, energy-efficient, and cost-effective manner. As a result, more and more … Read more