SK Hynix is the leader in the HBM market, currently holding over 60% market share. The company is also making the fastest progress on the sixth generation HBM product, HBM4, with plans to deliver 12-layer HBM4 samples to NVIDIA by March 2025, and the first batch of products by June 2025, indicating that mass production … Read more
1. AMD Unveils the Strongest AI Combination Ever, “AMD YES” Resounds in the AI Battlefield The world’s second-largest AI chip manufacturer, AMD, made a significant impact at the Advancing AI conference! The flagship MI350 series and the next-generation MI400 series made a splash, featuring 432GB of HBM4 memory for the first time, with single GPU … Read more
Due to the application of the foundry process for the first time in the sixth generation of high bandwidth memory (HBM4) as the brain of the “logic chip”, it has been reported that the test yield of logic chips produced by Samsung Electronics’ foundry division is stable. Analysts suggest that Samsung Electronics, which has lagged … Read more
On April 2, GUC Creative Electronics, a Taiwanese chip service company with over one-third ownership by TSMC, announced the successful tape-out of the world’s first HBM4 IP (including controller and PHY physical layer) using TSMC’s advanced N3P process and CoWoS-R advanced packaging. GUC’s HBM4 IP supports data transfer rates of up to 12Gbps. Compared to … Read more