HBM4

Significant Breakthrough in Samsung’s HBM4 Logic Chip

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Significant Breakthrough in Samsung's HBM4 Logic Chip

Due to the application of the foundry process for the first time in the sixth generation of high bandwidth memory (HBM4) as the brain of the “logic chip”, it has been reported that the test yield of logic chips produced by Samsung Electronics’ foundry division is stable. Analysts suggest that Samsung Electronics, which has lagged … Read more

GUC Creative Electronics Announces Successful Tape-Out of the World’s First HBM4 IP

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GUC Creative Electronics Announces Successful Tape-Out of the World's First HBM4 IP

On April 2, GUC Creative Electronics, a Taiwanese chip service company with over one-third ownership by TSMC, announced the successful tape-out of the world’s first HBM4 IP (including controller and PHY physical layer) using TSMC’s advanced N3P process and CoWoS-R advanced packaging. GUC’s HBM4 IP supports data transfer rates of up to 12Gbps. Compared to … Read more