PCB deformation

Comprehensive Solutions for PCB Deformation in BGA Reflow Soldering

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Comprehensive Solutions for PCB Deformation in BGA Reflow Soldering

📌 Problem Overview BGA components are prone to deformation during the reflow soldering process due to high thermal stress. This deformation can lead to poor contact between BGA solder balls and pads, resulting in cold solder joints, short circuits, or solder joint fractures due to stress concentration in later usage. The following table summarizes the … Read more

Causes of PCB Deformation and Improvement Measures

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Causes of PCB Deformation and Improvement Measures

During the reflow soldering process, circuit boards are often prone to warping and bending. In severe cases, this can lead to issues such as cold solder joints and component misalignment. How can we overcome these challenges? 1. The Dangers of PCB Deformation In automated surface mount lines, if the circuit board is not flat, it … Read more