Analysis and Improvement Discussion on Through-Hole ICD Issues in PCB Manufacturing
Failure of PCB Through-Hole ICD: Analysis and Prevention of Inner Layer Interconnection Defects As electronic products evolve towards higher density and reliability, ICD issues have increasingly become a key factor affecting PCB quality. The risk of ICD failure significantly increases, especially in high-frequency, high-speed materials, thick boards, and HDI boards. Understanding the mechanisms of ICD … Read more