[SemiDrive Technology July News]
PART 01
Company News
Beijing Daily: Yin Li visited the Economic Development Zone, entering the Beijing Humanoid Robot Innovation Center, automotive-grade chip design companies, and other locations to investigate the development and expansion of strategic emerging industries.
On July 16, Beijing Municipal Party Secretary Yin Li inspected the strategic emerging industries in the Economic Development Zone, visiting SemiDrive Technology to gain insights into the company’s development and R&D achievements in smart cockpits and intelligent vehicle control. Secretary Yin affirmed SemiDrive’s breakthroughs in key core technologies and encouraged the company to seize the opportunity of automotive intelligence development, continuously strengthen technological innovation and product iteration, and contribute to building a highland for intelligent connected new energy vehicles in Beijing.
SemiDrive Technology participated in the 7th Supply Chain Innovation Technology Exhibition at FAW Group
From July 15 to 18, SemiDrive Technology participated in the 7th FAW Supply Chain Innovation Technology Exhibition, showcasing a full range of chip products for smart cockpits and intelligent vehicle control. Leaders such as Changchun Mayor Wang Zilian and FAW General Manager Liu Yigong visited the booth. As one of the first partners of FAW, SemiDrive chips have been mass-produced in several models, including Hongqi E-HS9 and Bestune T90. In the future, both parties will further deepen cooperation in technology R&D and ecosystem building.
Yanzhi Automotive: WAIC 2025 Forum Highlights | SemiDrive Technology Shares Optimal AI Cockpit Chip Solution
On July 27, at the World Artificial Intelligence Conference (WAIC 2025), SemiDrive Technology’s Product Marketing Director Han Ying delivered a speech sharing the company’s scenario-driven AI cockpit chip solution. In response to market demand for high efficiency and cost-effective solutions, SemiDrive launched the latest generation X10 chip designed for edge large models. This chip uses a 4nm automotive-grade process and has an NPU computing power of 40 TOPS, efficiently supporting the operation of 7B multimodal large models in vehicles while also accommodating multi-task requirements such as 3D HMI.
SemiDrive Technology showcased at the Nagoya Automotive Engineering Exhibition in Japan, engaging in deep exchanges with well-known automotive companies
From July 16 to 18, SemiDrive Technology presented its full range of product solutions at the Nagoya Automotive Engineering Exhibition in Japan, engaging in deep exchanges with renowned OEMs and Tier 1 suppliers such as Toyota, Honda, and Denso. During the exhibition, SemiDrive focused on showcasing the X9 smart cockpit platform integrated with P3 SPARQ OS (based on AAOS). Currently, SemiDrive’s automotive chip products have been mass-produced in Nissan Sylphy and Teana models, and the company is continuously empowering global automotive customers through localized teams in Japan, Germany, and other regions.
SemiDrive Technology collaborates with Lichuan to develop in-vehicle SoC reference design, aiding in the realization of high-performance, compact smart cockpit systems
Recently, SemiDrive Technology and analog IC design company Lichuan jointly launched the reference design “SD210” aimed at smart cockpits. This design is based on SemiDrive’s X9 series SoC and is equipped with Lichuan’s high-performance PMIC products, flexibly meeting diverse power supply needs and assisting customers in developing high-performance, compact smart cockpit systems. This collaboration is a continuation of their successful partnership on the X9M/E products, aimed at continuously enhancing the convenience and safety of automotive infotainment systems.
Industry News
PART 2
China Daily: Chinese Automotive Parts Suppliers Lead Global Intelligent Transformation Wave
Chinese automotive parts suppliers are transforming from key component providers to co-developers, leading the global intelligent transformation of automobiles. In the chip sector, collaborative innovation models are also thriving. SemiDrive Technology’s Vice President Chen Shujie pointed out: “Collaborative development requires a deep understanding of automotive electronic architecture and close cooperation with vehicle manufacturers.” Currently, SemiDrive Technology has established joint laboratories with several automakers, including SAIC Volkswagen, to jointly promote the development of intelligent automotive software and hardware platforms.
Facetop Smart Automotive: L3 Level Cockpit SoC Selection and Comparison Analysis
As cars evolve from “mobile tools” to “third living spaces,” L3 level smart cockpits are becoming the core battlefield for automakers’ premiumization. The hard requirements for five-screen linkage, cabin-driving integration, and 3D real-time rendering pose nearly harsh challenges for cockpit SoCs in terms of computing power and functional safety. The SemiDrive X10 series products adopt an ARMv9.2 CPU architecture optimized for AI computing, with CPU performance reaching 200K DMIPS; it also integrates an 1800 GFLOPS GPU and a 40 TOPS NPU, and is equipped with up to 128-bit LPDDR5X memory interface, achieving speeds of 9600 MT/s, providing an ultra-large bandwidth of 154GB/s for the entire system. In terms of process technology, the X10 products utilize advanced 4nm processes, showing significant improvements in transistor density, performance, and power consumption control.
Nikkei BP: Chinese Cutting-Edge Automotive Chips Rapidly Entering the Global Market
SemiDrive Technology, established in 2018, is an emerging enterprise that, in addition to cockpit SoCs, also ventures into MCUs (Microcontroller Units). Centered around Chinese domestic automotive manufacturers, it is widely adopted from mass-market vehicles to high-end cars. Among Japanese companies, Honda and Nissan’s joint ventures in China also utilize SemiDrive Technology’s cockpit SoCs. SemiDrive Technology showcased the X9 smart cockpit platform integrated with the P3 in-vehicle infotainment solution SPARQ OS at the 2025 Shanghai Auto Show.
Gaishi Automotive Community: Plenty of “insider information”! Overview of core component suppliers for Li Auto i8
On the evening of July 29, Li Auto’s six-seat pure electric SUV—Li Auto i8 was officially launched. The Li Auto i8 achieves intelligent control through its self-developed central domain controller XCU and innovative intelligent control algorithms, which can continuously OTA upgrade based on scenarios and user needs. The XCU is equipped with SemiDrive G9 high-performance domain control chip, supporting control functions for the range extender system, suspension system, air conditioning system, seat system, and thermal management system.
Mobility Hundred Meeting: Chinese cockpit chips challenge Qualcomm without brute force
While local cockpit chips are catching up, Qualcomm is also about to launch a new generation of products. At this critical transition point, will local cockpit chips speed ahead or fall behind again? An insider from the smart cockpit industry told us, “If local cockpit chips can provide more cost-effective solutions under similar performance conditions, there may be an opportunity.” Most local cockpit chips are positioned against Qualcomm’s offerings, competing in a differentiated manner.
For example, Huawei’s 9610A adopts a “performance for area” strategy in its development. According to data released by JAC Motors, its CPU performance reaches 200k DMIPS, higher than Qualcomm’s 8155 at 105k DMIPS. The X9SP in SemiDrive’s X9 series, based on a hard isolation architecture and hardware virtualization technology, provides a single-chip solution for cockpit domain control, achieving “cockpit-parking integration.”
Gaogong Intelligent Automotive: The turning point has arrived! Agent on board ignites cockpit revolution, who is racing to seize the next market opportunity?
Smart cockpits are accelerating their transition from “passive response” to “active intelligence,” with AI Agents becoming mainstream. In this process, as the “brain” of the smart cockpit, cockpit SoCs are at the forefront, determining whether AI Agents and multimodal large models can be implemented and the quality of the experience. As a representative of local suppliers in China, SemiDrive Technology has launched a new generation of AI cockpit SoC—X10, utilizing a 4nm process, with NPU computing power reaching 40 TOPS, while also matching a 128-bit LPDDR5X memory interface, achieving a bandwidth of 154 GB/s, which is more than twice that of the current mass-produced flagship cockpit chips. While ensuring the full performance of AI large models, the SemiDrive X10 can also accommodate the parallel operation needs of traditional cockpit applications such as 3D HMI and multi-screen high-definition display.
About SemiDrive
SemiDrive Technology is a leader in all-scenario intelligent automotive chips, focusing on providing high-performance, high-reliability automotive-grade chips covering smart cockpits and intelligent vehicle control, encompassing the most core chip categories of future automotive electronic and electrical architecture.
All series of SemiDrive chips have been mass-produced, with shipments exceeding 8 million units. SemiDrive currently has over 200 designated projects, serving more than 260 customers, covering over 90% of domestic OEMs and some international mainstream automakers, including SAIC, Chery, Changan, Dongfeng, FAW, Nissan, Honda, Volkswagen, and Li Auto.
Five Certifications for SemiDrive’s Success
· TÜV Rheinland ISO 26262 ASIL D Functional Safety Management System Certification
· AEC-Q100 Grade 1/Grade 2 Reliability Certification
· TÜV Rheinland ISO 26262 ASIL B/D Functional Safety Product Certification
· TÜV Rheinland ISO/SAE 21434 Automotive Cybersecurity Management System Certification
· Certification from the State Administration for Market Regulation and the National Cryptography Administration for National Secret Information Security
