With the continuous improvement of integrated circuit manufacturing technology and process levels, CPUs are increasingly developing towards high integration, miniaturization, and multifunctionality, leading to a sharp increase in CPU heat. In high-temperature environments, the aging rate, loss rate, and failure rate of chips increase exponentially, affecting the normal operation of CPUs and related devices.
Left: Power, size, and junction temperature of a certain automotive chip over time
Right: Relationship between electronic product failure rate and temperature
Feiteng server CPUs also have higher requirements for cooling solutions. Firstly, coolers need to have a larger surface area, higher thermal conductivity, and better cooling performance to cope with the large amount of heat generated by high power density. Secondly, the design of the cooling solution must meet cooling needs while controlling noise and considering costs. Additionally, with the popularization of green energy-saving and low-carbon environmental protection concepts, as well as the implementation of the national dual-carbon strategic goals, the design goal of low-power, high-energy-efficiency cooling systems has also become a new challenge.
To address the cooling issues faced by Feiteng server CPUs and better assist industry clients in selecting suitable cooling solutions for different application scenarios, Feiteng has recently launched the “Feiteng Server CPU Cooling Solution White Paper” in collaboration with several cooling manufacturers, covering various cooling systems such as air cooling and liquid cooling, which have passed reliability and stability testing and have been successfully applied to Feiteng platform chip products.
Air Cooling: General Economy
Air cooling solution
In terms of air cooling solutions, Feiteng has collaborated with manufacturers such as Anminrui, Bowanda, and Keledi to develop horn-shaped heat sinks. By designing heat pipes and horn fins, the heat exchange area of the cooler is effectively increased, significantly reducing the thermal resistance of the cooler. Additionally, Feiteng has also jointly developed L-shaped air coolers with manufacturers such as Shengjiu Technology, Keledi, Anminrui, and Bowanda, which have the advantages of compact structure, regular shape, and strong versatility.
Liquid Cooling: Efficient and Quiet
Liquid cooling solution
For high-performance application scenarios, Feiteng has partnered with manufacturers such as Bih Electric, AVIC Optoelectronics, Haichuan Thermal Energy, and Anminrui to launch liquid cooling solutions. Compared to air cooling solutions, liquid cooling solutions have superior thermal performance in a more compact size, able to meet the cooling demands under high power density, with lower operational noise.
Feiteng cooling ecosystem cooperation progress
One of the main factors restricting the development of high-performance chips is cooling capability. As a leading domestic CPU enterprise, Feiteng has always adhered to the concept of “openness, inclusiveness, and win-win cooperation” to participate in the construction of the domestic cooling ecosystem. By establishing joint laboratories, Feiteng shares cooling testing equipment and test data with cooling manufacturers, gradually building a unified standard for cooling testing and evaluation. In addition, Feiteng also regularly publishes the “Feiteng Hardware Ecosystem Product Manual” (click here to review) each year, promoting cooling products developed based on the Feiteng chip platform free of charge to cooling manufacturers, accelerating the construction process of the domestic cooling ecosystem. Currently, Feiteng has established cooperative relationships with nearly 20 domestic cooling manufacturers, launching 58 cooling products based on Feiteng CPUs and promoting their application in customer projects, receiving unanimous recognition and praise from clients.The “Feiteng Server CPU Cooling Solution White Paper” will provide a detailed introduction to cooling solutions based on Feiteng CPUs, guiding client engineers in the design and development of cooling products. We sincerely welcome cooling manufacturers to join the domestic cooling ecosystem, working together to collaborate on new air cooling technologies (such as high-performance VC and heat pipes), reliable and mature liquid cooling technologies (water cooling, immersion), new cooling materials and technologies based on multiphase flow technology, high-performance and high-reliability thermal interface materials, high-precision cooling testing instruments and equipment, and contribute to the development of domestic chip enterprises!
About the Green Computing Industry Alliance
Since its establishment in 2016, the Green Computing Industry Alliance aims to collaboratively build a green, open, independent, and shared ecological system, dedicated to promoting the development of the green computing industry, and building a platform for industry communication and cooperation to enhance enterprises in fields such as PCs, servers, storage, operating systems, and databases, promoting win-win cooperation in the computing field. It has now become a global alliance with the most complete Arm infrastructure server chip partners, including Kunpeng, Feiteng, Ampere, and Marvell.
