DEMCR

RC Parallel Design Between PCB GND and Chassis GND: Principles, Advantages, and Application Comparisons

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RC Parallel Design Between PCB GND and Chassis GND: Principles, Advantages, and Application Comparisons

RC Parallel Design Between PCB GND and Chassis GND: Principles, Advantages, and Application Comparisons -Compare- Enning EMC Engineering Summary Overview Prospect feed In metal-cased electronic devices, the connection design between PCB GND (signal ground / PCB ground) and chassis GND (enclosure ground / protective ground) directly affects the electrical safety, electromagnetic compatibility (EMC), and signal … Read more

PCB Design Guide: Safety Regulations, Layout and Routing, EMC, Thermal Design, and Process

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PCB Design Guide: Safety Regulations, Layout and Routing, EMC, Thermal Design, and Process

Safety Distance Requirements This includes electrical clearance (air gap), creepage distance (surface distance), and insulation penetration distance. 1. Electrical clearance: The shortest distance measured along the air between two adjacent conductors or between a conductor and the surface of an adjacent motor casing. 2. Creepage distance: The shortest distance measured along the insulating surface between … Read more

Are There Still Issues in Switch Mode Power Supply PCB Design? Must Read This Article with Circuit Examples Explained

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Are There Still Issues in Switch Mode Power Supply PCB Design? Must Read This Article with Circuit Examples Explained

Today, we mainly discuss: improvements in switch mode power supply design. 1. PCB Coupling Engineers typically pay close attention to two coupling factors in SMPS layout, as shown in the figure below: Voltage switching node, which has high dv/dt Thermal current loop, which contains the highest di/dt in the subsystem Diagram showing the di/dt and … Read more

Why Define Maximum Frequency for SPI Interface

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Why Define Maximum Frequency for SPI Interface

This is a very professional and important question, involving core considerations of hardware design and electromagnetic compatibility. Let’s break it down clearly. Core Explanation in One Sentence To ensure that the SPI interface does not generate excessive electromagnetic interference (EMI), and thus passes EMC certification, hardware design must set a maximum frequency limit based on … Read more

Stability Testing of ESP32: EMC Testing Methods

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Stability Testing of ESP32: EMC Testing Methods

In ESP32 development, EMC (Electromagnetic Compatibility) testing is a key aspect to ensure that the device operates normally in an electromagnetic environment without causing interference to other devices. The following are EMC testing methods based on the characteristics of ESP32, international standards, and practical testing experience, covering testing categories, standards, processes, problem analysis, and optimization … Read more

Optimizing RS-485 Timing Performance: How ADI Addresses Jitter and Long-Distance Communication Challenges

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Optimizing RS-485 Timing Performance: How ADI Addresses Jitter and Long-Distance Communication Challenges

According to industry experts such as PROCENTEC, applications based on RS-485 fieldbus technology (PROFIBUS®) are continuously growing, and industrial Ethernet (PROFINET) applications are also rapidly increasing. In 2018, a total of 61 million PROFIBUS fieldbus nodes were installed globally, with a 7% year-on-year growth in PROFIBUS process automation (PA) devices. The installation base for PROFINET … Read more

Key Elements for Post-Design PCB Inspection!

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Key Elements for Post-Design PCB Inspection!

When a PCB board has completed its layout and routing, and there are no errors reported in connectivity and spacing, does that mean the PCB is finished? The answer is certainly no. Many beginners, as well as some experienced engineers, often rush through the process due to time constraints, impatience, or overconfidence, neglecting the post-design … Read more

Military-Grade Circuit Board Design: EMC/EMI is Core, Fundamental Theory is Key

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Military-Grade Circuit Board Design: EMC/EMI is Core, Fundamental Theory is Key

An electronic engineer asked a senior in the military industry: “I heard that military-grade circuit boards are the most difficult, is that true?” To his surprise, the military expert replied: “Actually, it’s not that difficult; the key is to get EMC and EMI right.” This left the questioner astonished—”Isn’t it difficult to get EMC and … Read more

Sharing Experiences on Analog IC Tape-Out

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Sharing Experiences on Analog IC Tape-Out

The following content is the experience of EETOP user zjyuestc regarding analog IC tape-out, now shared for everyone’s reference. Analog IC design has emerged relatively late in China, and there are currently very few mature designs. Most of the chips produced are essentially imitations of products from major international companies like TI, Maxim, LT, etc., … Read more

Detailed Explanation of Semiconductor IGBT with Built-in Fast Recovery Diode (FRD)

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Detailed Explanation of Semiconductor IGBT with Built-in Fast Recovery Diode (FRD)

IGBT with Built-in Fast Recovery Diode (FRD) IGBT product lineup includes types with built-in fast recovery diodes (hereinafter referred to as “FRD”). In inverter and motor drive applications using IGBT, the diode is also used as a path for the reverse current generated during switching. This diode is known as a “freewheeling diode,” and is … Read more