Introduction to the Basics of PCB/HDI Manufacturing: Plating Process (Part 2)
Continuing from the first part, we will further introduce the basics of HDI plating. 4.3.2 Plasma – Key Control Points: 4.3.3 Plasma – Quality Inspection: 4.4.1 Copper Deposition – Subprocess Function: By using swelling to remove the drilling debris inside the holes, the charge inside the holes is adjusted to deposit activated palladium ions, which … Read more