2.5D packaging Articles - Page 2 of 4

The Era of AI Agents: Complete Closed-Loop Capabilities Transitioning Humans from Executors to Supervisors

2026-02-16 by boardor

AI Agents and Key Technological Pathways for Enterprise-Level Applications Executive Summary This article deeply analyzes the five-stage development theory of Artificial General Intelligence (AGI) and the key technological pathways for enterprise-level AI applications, revealing that current AI technology is at a critical turning point from being “reasoners” to “agents.” This transition will reshape enterprise AI … Read more

Recently, a 100 Billion Yuan Chip Contract Signed! Musk’s Hardcore: ‘I Will Personally Oversee the Battle’!! Samsung Kneels to Deliver a Game-Changer: SpaceX Unleashes the Semiconductor Packaging Blade!

2026-02-14 by boardor

In the past 24 hours, the Texas night sky has not yet faded. SpaceX and Samsung Semiconductor have put their signatures on the contract —an advanced packaging production line worth 100 billion yuan. More dramatically, Musk made the decision on the spot, dropping a hardcore catchphrase: ‘I will personally oversee the battle!’ The adrenaline of … Read more

Linux | 22. Decompression and MD5 Checksum Verification

2026-02-11 by boardor

Introduction In the previous lesson, we introduced the use of soft links and hard links in Linux | 21 to help save some coding time and reduce disk storage space. However, using links only saves redundant space; to truly save disk storage, we need to rely on file compression. This section will mainly discuss the … Read more

Publishing QT Applications on ARM64 Linux

2026-01-31 by boardor

Publishing QT applications on ARM64 Linux follows a process similar to that on Windows, utilizing the Linuxdeployqt tool;1. Download the packaging tool git clone https://github.com/probonopd/linuxdeployqt.git or download the source code from GitHub https://github.com/probonopd/linuxdeployqt/tree/master Download Appimagetool-aarch64.AppImage https://github.com/AppImage/AppImageKit/releases 2. Compile the packaging tool source code If QT is installed successfully, qmake will be configured by default qmake … Read more

Vietnam’s Semiconductor Acceleration: Diverting Orders from China?

2026-01-28 by boardor

As the topic of “some factories in China relocating to Vietnam” gains attention, a recent investment announced by South Korea’s Samsung has added fuel to the fire in the semiconductor industry. According to Vietnamese media reports, Samsung revealed on the 5th local time that it plans to begin mass production of semiconductor packaging components at … Read more

Introduction to Semiconductor Packaging Processes and Equipment

2026-01-28 by boardor

Disclaimer: The article belongs to the author, and reproduction is for sharing and learning purposes only, not for any other commercial use! If there is any infringement, please contact us for deletion! (Mobile WeChat same number 15150147049) The semiconductor manufacturing process can be divided into front-end processes and back-end processes. The front-end process mainly involves … Read more

Common Packages for Programming Chips

2026-01-26 by boardor

First, we need to understand what packaging is, which refers to the casing installed on semiconductor integrated circuit chips. It serves to place, fix, seal, protect the chip, and enhance thermal performance, while also acting as a bridge between the internal world of the chip and the external circuit, allowing for different appearances based on … Read more

Multi-Agent Orchestration: Shipped. Ephemeral Agent Creation: Next

2026-01-16 by boardor

A product manager friend recently approached me with a screenshot of Genspark’s all-agents interface. “Kay,” he asked, “you have shipped so many agent features. How do you decide what to add next? How do you ensure users can keep up with all these new capabilities?“ My answer was simple: We don’t ensure it, and we … Read more

Jiangsu Xinde Semiconductor Technology Co., Ltd.

2026-01-07 by boardor

Jiangsu Xinde Semiconductor Technology Co., Ltd., established on September 11, 2020, is located in the Pukou Development Zone of Nanjing, Jiangsu, China, with a total investment of 6 billion yuan. It is a technology enterprise focused on the field of semiconductor packaging and testing. The company possesses the capability for mid-to-high-end product packaging design and … Read more

The Transformative Journey in Robotics: Insights from AI Jim Fan

2026-01-05 by boardor

Transition AI Jim Fan: Recently, I have been somewhat silent on X. This year has been a transformative journey for me. Although emerging large language models like Grok-4 and Kimi K2 are impressive, the field of robotics still resembles a wondrous western wilderness. It reminds me of the NLP field in 2018, when GPT-1 was … Read more