High Parallel Testing of Mobile PMIC in WLCSP Package In this article, we introduce the high parallel testing of mobile PMIC in WLCSP package. During this process, we illustrate the testing of a small chip that integrates a lithium-ion charger, a micro USB interface controller, RGB, and LED drivers. We also compare and explain the … Read more
1. Overview In the assembly and soldering of electronic products, the phenomenon of cold solder joints has always been one of the most prominent issues troubling the reliability of solder joints, especially in high-density assemblies and lead-free soldering. Historically, there have been numerous cases where electronic products (including civilian and military) have failed due to … Read more
Read Good Books Together Scan to Follow the Semiconductor Packaging Engineer Home Video Account Scan to Follow the Semiconductor Packaging Engineer Home WeChat Official Account
First, we need to understand what packaging is, which refers to the casing installed on semiconductor integrated circuit chips. It serves to place, fix, seal, protect the chip, and enhance thermal performance, while also acting as a bridge between the internal world of the chip and the external circuit, allowing for different appearances based on … Read more