Jiangsu Xinde Semiconductor Technology Co., Ltd., established on September 11, 2020, is located in the Pukou Development Zone of Nanjing, Jiangsu, China, with a total investment of 6 billion yuan. It is a technology enterprise focused on the field of semiconductor packaging and testing. The company possesses the capability for mid-to-high-end product packaging design and has developed and produced advanced packaging and testing technologies such as Bumping, WLCSP Flip Chip PKG, QFN, BGA, and SiP, providing one-stop high-end packaging and testing services for domestic and international customers.