Line-by-Line Interpretation of Armv8-A Assembly SMP Boot Code

This article provides a line-by-line explanation of the Armv8-A assembly code sourced from ArmĀ® Development Studio. It focuses on the boot sequence of the AArch64 MPCore processor. This code initializes the system from Exception Level 3 (EL3, typically the Secure Monitor mode) and transitions to Exception Level 1 (EL1, typically the OS mode), during which … Read more

Understanding and Practicing ARMv8 Bare Metal Code – The Concept of Bare Metal Code

This example code is derived from the sample code included in the ARM Development Studio: Arm\Development\Studio 2022.0\examples\docs\baremetal_v8. The following is an interpretation based on this type of example, gradually analyzing the implementation logic of bare metal code in conjunction with the characteristics of the ARMv8 architecture. 1. What is Bare Metal Code? Bare Metal code … Read more

Firmware System Architecture Based on ARMv8

The firmware system based on the ARMv8 architecture The firmware system based on the ARMv8 architecture consists of multiple layers and modules designed to provide secure, flexible, and efficient booting and management for ARMv8-based servers and embedded devices. Its design structure typically includes the following main components and stages: 1. Overview of Firmware Architecture The … Read more

MediaTek Prepares for Dimensity 9300 CPU with No Little Cores! Arm’s Latest Cortex-X4 Super Core

Yesterday, Arm Holdings released its 2023 mobile processor solutions, including the Cortex-X4 super core, A720, and A520 next-generation CPUs, as well as the Immortalis G720, Mali G720, and Mali G620 fifth-generation GPUs.MediaTek also officially announced a teaser stating that its next-generation flagship chip (likely named Dimensity 9300) will adopt Arm’s latest Cortex-X4 and Cortex-A720 CPU … Read more

First to Support 9.6Gbps LPDDR5T Memory! MediaTek Dimensity 9300 Chip Expected to Launch in October

This May, MediaTek launched the new Dimensity series, introducing the flagship Dimensity 9200+ chip. The Dimensity 9200+ chip is based on TSMC’s second-generation 4nm process and features an octa-core CPU, including one Arm Cortex-X3 super core with a clock speed of up to 3.35GHz, three Arm Cortex-A715 large cores at 3.0GHz, and four Arm Cortex-A510 … Read more

Is iPhone Leading Android by 9 Years? Official Response Reveals Limitations…

If you were to ask me which device has left a deep impression on me during my time with the iPhone, it would undoubtedly be the iPhone 5s. For both Apple and users, the iPhone 5s is a product of epoch-making significance. Its release marked the true entry of the iPhone into the 4G era, … Read more

Real-Time Ray Tracing! Android Flagships to Feature It in Six Months

Real-time ray tracing will become standard. In addition to the iPhone equipped with Apple’s self-developed A-series chips, most Android manufacturers’ SoCs come from Qualcomm, MediaTek, and Samsung. Image source: wccftech. Qualcomm, MediaTek, and Samsung are not deeply involved in the independent design of CPU and GPU architectures for their SoCs, leaning more towards Arm’s public … Read more

The Past and Future of the Android Flagship King

Since Google launched the first Android phone in 2008, the internet world has entered the fast lane. Android and iOS have been in a fierce competition, showcasing the power of small smartphones and giving rise to the mobile internet industry, which has dramatically transformed the real world. Throughout these years, an American company has accompanied … Read more

Huawei to Launch Its Strongest Chip Kirin 960 and Flagship Mate 9 to Compete with iPhone 7

Recent patent disputes in the tech industry reflect the importance of independent research and development for companies aiming to grow. In this regard, Huawei has always been at the forefront among domestic manufacturers, as it is one of the few smartphone manufacturers with self-developed processors. Currently, the strongest Huawei processor is the Kirin 955 used … Read more

Weekly News on the IoT IC Ecosystem (Week 10 of 2016)

AuthorLi Ying (WeChat ID: ilovekm2008) Deputy Editor of “Smart Product Circle” Big Data, Cloud Computing, and the Internet of Things included in the 13th Five-Year Plan Big Data, Cloud Computing, and the Internet of Things included in the 13th Five-Year Plan Strengthening the leading role of innovation to inject strong momentum into development. Innovation is … Read more