Embedded Hardware

 

  • System on Modules (SoM)
  • Single Board Computers (SBC)
  • Development Boards
  • Industrial PCs & Embedded Computers
  • IoT & Edge Computing Gateways
  • AI & Machine Learning Modules
  • Rugged & Industrial-Grade Components
  • Peripherals & Expansion Modules (Displays, Sensors, Power Modules)

NXP and Rimac Technology Collaborate on Centralized Vehicle Architecture for Software-Defined Vehicles

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NXP and Rimac Technology Collaborate on Centralized Vehicle Architecture for Software-Defined Vehicles

NXP Semiconductors announced on the 13th that it will collaborate with Rimac Technology, a supplier specializing in high-performance control systems, to develop a centralized vehicle architecture for Software-Defined Vehicles (SDV).The solution developed by the two companies is based on NXP’s S32E2 processor, which is part of NXP’s S32 automotive processing platform. The S32E2 is a … Read more

From 0 to 1: A Detailed Breakdown of the SAW Wafer Fabrication Process (Part 1 – Photolithography)

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From 0 to 1: A Detailed Breakdown of the SAW Wafer Fabrication Process (Part 1 - Photolithography)

China and the U.S. Trade: The Darling of the Era On September 14, 2020, late at night, Hsinchu, Taiwan. TSMC’s factory was brightly lit, and the machines on the production line were still running at high speed, but there was an unusual tension in the air. Just a few hours earlier, the U.S. Department of … Read more

Technical Article | Optional Spacing and Component Isolation for Printed Circuit Boards with ‘ic’ Protection Level Assembly

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Technical Article | Optional Spacing and Component Isolation for Printed Circuit Boards with 'ic' Protection Level Assembly

PCEC Technical Article As an option to reduce the spacing requirements for conductive components, when the pollution level is controlled to level 2 or lower, the spacing and component isolation of printed circuit boards with ‘ic’ protection level assembly can use the reduced spacing shown in Table 1 under the following conditions. That is, if … Read more

Technical Article | Evaluation of Temperature Classes for Printed Lines on Class I and Class II Printed Circuit Boards

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Technical Article | Evaluation of Temperature Classes for Printed Lines on Class I and Class II Printed Circuit Boards

Technical Article Technical Articles PCECDuring the review of technical materials, it was found that there are some misconceptions regarding the evaluation of temperature classes for printed lines on Class I and Class II circuit boards. Additionally, some requirements in GB/T 3836.4—2021 “Explosive Atmospheres Part 4: Equipment Protected by Intrinsic Safety ‘i’” were not clearly stated, … Read more

Guide to Surface Treatment of Copper Foil and PCB Manufacturing

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Guide to Surface Treatment of Copper Foil and PCB Manufacturing

Guide to the Manufacturing Methods of Printed Circuit Boards 1. Overview This article discusses the methods for surface treating copper foil, carrier-attached copper foil, and their use in manufacturing copper-clad laminates and printed circuit boards. The patent primarily focuses on how to optimize the adhesion of plated circuits, etchability of electroless copper, and dry film … Read more

Detection of Odorous Gases Emitted from Circuit Boards

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Detection of Odorous Gases Emitted from Circuit Boards

Fire Hazard Pre-Detection: Detection of Odorous Gases Emitted from Circuit Boards In recent years, the proliferation of IoT has led to the high performance and miniaturization of electrical products, resulting in circuit boards developing towards higher density. This high-density circuit board is at risk of quality degradation due to long-term use and thermal accumulation, which … Read more

New Circuit Board Materials Developed in Wuhan: A PhD Student’s Startup Enters the ‘Seed’ Stage

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New Circuit Board Materials Developed in Wuhan: A PhD Student's Startup Enters the 'Seed' Stage

Recently, in the laboratory of the School of Materials Science and Engineering at Wuhan University of Technology, the hot press machine roared as it mixed, pressed, disassembled, and tested the performance of a high-frequency, high-speed, low-loss copper-clad laminate that was “ejected” by the machine. “The quality of 5G network signal transmission is crucially dependent on … Read more

Guide to Enhanced Heat Dissipation Printed Circuit Boards

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Guide to Enhanced Heat Dissipation Printed Circuit Boards

The structure, manufacturing methods, and applications of printed circuit boards (PCBs) with electronic components. The core of this patent lies in improving heat dissipation efficiency by directly connecting heat dissipation elements to the wiring layer of the PCB, allowing for embedding in high-heat components such as power amplifiers. Key Concepts and Components Printed Circuit Board … Read more

Unit 2: Laminate Imperfections in Printed Circuit Boards

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Unit 2: Laminate Imperfections in Printed Circuit Boards

Laminate imperfections in printed circuit boards (Laminate Imperfection) refer to internal and external defects that can be observed from the surface of the printed board. There are more than a dozen types of laminate imperfections, including Measling, Crazing, Delamination/Blistering, Foreign Inclusion, Weave Exposure, Mechanically Induced Disrupted Fiber, Scratch, Dent, Tool Mark, Surface void, Color Variation … Read more

Introduction to the Stop Position Compensation Function of Fuji NXT SMT Placement Machine

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Introduction to the Stop Position Compensation Function of Fuji NXT SMT Placement Machine

This function detects the profile of the circuit board loaded into the machine and the F positioning point to perform stop position compensation, maintaining a fixed function. It can effectively address situations where the stop position fluctuates due to differences in the weight or size of the circuit board. 1. Installation of Low-Reflection Board If … Read more