Introduction to Semiconductor Packaging Processes and Equipment

Introduction to Semiconductor Packaging Processes and Equipment

The semiconductor manufacturing process can be divided into front-end and back-end processes. The front-end process mainly involves wafer manufacturing, while the back-end process primarily focuses on packaging and testing. Among these, packaging (Package) in the back-end process refers to a series of technical methods that connect tested integrated circuit bare chips (Die) to external circuits, … Read more

Temperature Control System Based on 51 Microcontroller

Temperature Control System Based on 51 Microcontroller

Long press the QR code below to enter the public account Table of Contents General Design Description…………………………………………………………………………………………………………… I Introduction………………………………………………………………………………………………… II Chapter 1: Introduction………………………………………………………………………………………………………… 1 1.1 Overview…………………………………………………………………………………………………………… 1 1.2 Current Development Status at Home and Abroad…………………………………………………………………………………………. 1 1.2.1 Current Research Status Abroad……………………………………………………………………………………….. 1 1.2.2 Current Research Status in China………………………………………………………………………………………. 1 Chapter 2: Overall System Design…………………………………………………………………………………… 3 … Read more

Complete Technical Analysis of 51 Microcontroller and PC Serial RS-485 Communication: What You Should Know

Complete Technical Analysis of 51 Microcontroller and PC Serial RS-485 Communication: What You Should Know

In various fields such as industrial control and smart home systems, communication between devices is a key aspect of achieving system functionality. The RS-485 bus, with its strong anti-interference capability, long transmission distance, and multi-node communication advantages, has become a widely used serial communication standard. The 51 microcontroller, as a classic entry-level microcontroller, can achieve … Read more

Custom Ready-to-Use Products via 3D Printing

Custom Ready-to-Use Products via 3D Printing

MH Material Handling’s owners have always focused on innovation, both in production technology and in tools designed to enhance productivity. In this regard, additive manufacturing technology perfectly combines the advantages of both. After conducting some experiments with external suppliers, they decided to acquire a Mark Two™ printer for testing to help the engineering department explore … Read more

3D Printed Articulated Flexible Bunny – PLA Material, Movable Joints, Creative Desktop Pet DIY Model

3D Printed Articulated Flexible Bunny - PLA Material, Movable Joints, Creative Desktop Pet DIY Model

✨ Dynamic and Cute, Playful at Will —— This 3D printed articulated bunny is made of high-quality PLA material, environmentally friendly and safe, with a delicate touch. The unique flexible joint design allows the bunny’s ears, limbs, and tail to bend freely, posing in various adorable positions, making it both a healing item for your … Read more

3D Printing Insights | Evaluation of Domestic 3D Printing Materials in the Era of Tariffs

3D Printing Insights | Evaluation of Domestic 3D Printing Materials in the Era of Tariffs

With the adjustment of tariff policies and the revival of American manufacturing, this is an excellent time to explore domestic 3D printing materials in the United States. Overseas bloggers tested materials from 10 leading American manufacturers, showcasing their quality, diversity, and reliability against the backdrop of an unstable overseas supply chain. Although this article is … Read more

Lead-Free High Energy Storage Performance of Ternary Relaxor Ferroelectric Ceramics

Lead-Free High Energy Storage Performance of Ternary Relaxor Ferroelectric Ceramics

Title J. Am. Ceram. Soc.:Lead-Free High Energy Storage Performance Ternary Bi₀.₅Na₀.₅TiO₃-BaTiO₃-Nd(Mg₀.₅Hf₀.₅)O₃Relaxor Ferroelectric Ceramics Research Background Dielectric energy storage ceramics have significant potential in pulse power systems, but their energy density is far below the requirements of next-generation power electronics applications. BNT-based ceramics (Bi₀.₅Na₀.₅TiO₃) have become important candidate materials due to their lead-free nature, high polarization … Read more

Star Flash Dynamic: A New Player in Star Flash SoC with RISC-V Core, Tri-Mode, and High-Performance ISP

Star Flash Dynamic: A New Player in Star Flash SoC with RISC-V Core, Tri-Mode, and High-Performance ISP

According to a report by Electronic Enthusiasts (Author: Liang Haobin), by providing a transmission rate and connection stability stronger than Bluetooth, we have seen numerous brands and products supporting Star Flash connectivity in fields such as mice, keyboards, game controllers, and remote controls since last year, receiving positive market feedback. This year, among the new … Read more

Collaboration | Joint Development of In-Vehicle SoC X9SP Reference Design Equipped with SoC PMIC to Promote Smart Cockpit Adoption

Collaboration | Joint Development of In-Vehicle SoC X9SP Reference Design Equipped with SoC PMIC to Promote Smart Cockpit Adoption

Global semiconductor manufacturer ROHM (headquartered in Kyoto, Japan) announced a collaboration with leading automotive chip company, Sintronic Technology, to jointly develop the reference design “REF68003” aimed at smart cockpits. This reference design primarily covers Sintronic Technology’s smart cockpit SoC*1 “X9SP” product, which is equipped with ROHM’s PMIC*2 products and was showcased at the 2025 Shanghai … Read more

Xinchip Technology and Richtek Collaborate on In-Vehicle SoC Reference Design to Achieve High-Performance, Miniaturized Smart Cockpit Systems

Xinchip Technology and Richtek Collaborate on In-Vehicle SoC Reference Design to Achieve High-Performance, Miniaturized Smart Cockpit Systems

Xinchip Technology and analog IC design company Richtek have jointly launched the “SD210” reference design aimed at smart cockpits. This reference design is based on Xinchip’s X9 series smart cockpit SoC chips and incorporates Richtek’s SoC PMIC RTQ2209 and other products, fully meeting diverse power supply requirements and aiding in the realization of high-performance, miniaturized … Read more