China Successfully Develops New Technology for Chip Manufacturing
On the 27th, reporters learned from West Lake University that West Lake Instruments (Hangzhou) Technology Co., Ltd. (hereinafter referred to as “West Lake Instruments”), incubated by the university, has successfully developed an automated laser peeling technology for 12-inch silicon carbide substrates, solving the challenges of slicing ultra-large silicon carbide substrates of 12 inches and above. … Read more