New Technology Developed in Chip Manufacturing
According to news from Westlake University, Westlake Instrument (Hangzhou) Technology Co., Ltd., incubated by the university, has successfully developed an automated laser peeling technology for 12-inch silicon carbide substrates, solving the challenges of slicing ultra-large 12-inch and larger silicon carbide substrates. Compared to traditional silicon materials, silicon carbide has a wider bandgap, higher melting point, … Read more
