Regarding Chips! China Successfully Develops This New Technology
On the 27th, reporters learned from Westlake University that Westlake Instrument (Hangzhou) Technology Co., Ltd., incubated by the university,has successfully developed an automated laser peeling technology for 12-inch silicon carbide substrates, solving the challenges of slicing ultra-large silicon carbide substrates of 12 inches and above.The laser peeling system for silicon carbide substrates. Image source: Westlake … Read more