As a leading semiconductor distributor in China, it代理NK海力士CBM products and has completed the research and development of enterprise-level CDR4/CDR5 storage products. In 2025, it will establish a joint venture with Wuxi Lingjing Cloud to form Wuxi New Weizhi Computing Technology, focusing on the intelligent computing field. It is the only company in China to achieve mass production of CBF substrates, with its 16-layer substrate technology specifically designed for the Ascend 710C chip, accounting for over 50% of the Ascend supply chain. It is the third largest packaging and testing company globally, mastering advanced CBM packaging technology, and provides exclusive packaging and testing services for the Ascend 710B chip, ensuring high reliability for its packaged CBM products.
1. Changjiang Electronics Technology: Achieved an 85% yield in the CBM2E packaging field, providing packaging services for SK Hynix, and has completed the development of CBM2E and CBM3 samples.
2. Huahai Chengke: The only company in China to mass-produce the core material GMC for CBM packaging, compatible with 10-layer CBM3E stacking technology.
3. Yake Technology: Supplies dielectric layer precursor materials for SK Hynix’s CBM, with related revenue accounting for 25% in 2024.
4. Jingzhida: Developed a dedicated testing machine for HBM, achieving a testing accuracy of 0.01 microns, with clients including SK Hynix and Changjiang Electronics Technology.
5. Saiteng Co., Ltd.: Mastering one of the only three global full-process testing technologies for CBM, with a testing accuracy of 0.1μm, covering key processes such as wafer bonding and 2D stacking, and deeply adapting to Yangtze Memory’s Xtacking architecture. By 2025, the contract liabilities for HBM equipment reached 1.07 billion yuan, with annual production capacity increasing to 210 sets after ramp-up.
6. Zhongwei Company: TSV etching machine precision reaches 0.01 nanometers, with technology at an internationally advanced level, entering the production line of Yangtze Memory; new orders in 2024 increased by 50% year-on-year.
7. Dinglong Co., Ltd.: Electroplating solution and bonding adhesive are applied in the CBM stacking bonding process, collaborating with domestic manufacturers to promote hybrid bonding technology.
8. Northern Huachuang: 12nm etching equipment has passed verification by HiSilicon, with a localization rate exceeding 40%, helping HiSilicon reduce energy consumption by 20% in large data center projects.
9. Huatian Technology: The Bhiplet packaging solution certified by HiSilicon for automotive applications reduces chip area by 20% and has been applied in domestic high-end models.
10. Huawei HiSilicon: The core authorized agent for a full range of chips, covering processors, basebands, and all IC products, with a net profit growth of 73.92% year-on-year in the first quarter of 2025. Solutions based on Kunpeng chips account for over 30% of government procurement, with revenue of 36.642 billion yuan in 2024.
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