1、Objective：
To provide standard current indication guidelines for graphic plating.
2、Scope：
Current indication production.
3、Responsibilities：
3.1 Process Department: Responsible for writing the current indication (FA) and following up on the first piece of FA.
3.2 Plating: Responsible for plating the first piece according to FA instructions, and after the first piece is qualified and signed off, responsible for saving the FA documents.
3.3 Quality Department: Responsible for inspecting the first board and reviewing and issuing the current indication.
4、Production Process：
Trial board notification → Data search → Create graphic current indication → Graphic first piece → Copper thickness confirmation → Etching → Line width and spacing confirmation → QA review of current indication → Mass production.
5、Production Method：
5.1 Trial Board Notification：
To ensure normal production operation, when there is a new order to be produced, the plating department must notify the process department in advance to fill out the FA current indication form.
5.2 Search for Customer-Related Information：
5.2.1 Plating board dimensions;
5.2.2 Copper thickness requirements for holes and surfaces;
5.2.3 Hole diameter requirements, hole diameter tolerances, and minimum hole diameter;
5.2.4 Line width/spacing requirements;
5.2.5 Bottom copper requirements;
5.2.6 Board thickness requirements;
5.2.7 Surface treatment.
5.3 Create Current Indication:
5.3.1 Fill in the requirements correctly according to the current indication table, calculate the copper plating area based on the percentage of plating from the process card;
5.3.2 Refer to customer requirements, create technical standards and process standards, determine plating time and current density;
5.3.3 Calculate the number of boards per hanging bar:
Number of hanging boards = Plating board width / Hanging bar length
For example: If the plating board size is500mm*300mm and the hanging bar length is 3800mm,
then the number of hanging boards is calculated as3800/300″=12.66, which means 12 PNL can actually be hung, and the remaining points can be used for edge material.
The integer 12 indicates the number of hanging sections, and the hanging method is as shown below:
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/ / / |
C/S |
C/S |
C/S |
C/S |
C/S |
C/S |
C/S |
C/S |
C/S |
C/S |
C/S |
/ / / |
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↓ |
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←→ |
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↓ |
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500″×100″ |
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300 |
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500×100 |
The above diagram shows the hanging method when the short edge is used. If due to design reasons, the long edge can also be clamped as shown below:
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C/S |
C/S |
C/S |
C/S |
C/S |
C/S |
C/S |
/ / |
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↓ |
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←500→ |
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300×150 |
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Note: To achieve good plating results, ensure that the boards are symmetrically distributed during clamping, and that independent and connected positions are evenly distributed during design.
5.3.4 Current Calculation:
a．The plating area is generally calculated based on CAD/CAM, and when inputting current, it needs to be converted from square meters to square feet.
b．1m2=10.76ft2;
c．Current density is estimated based on copper plating capacity tests and experience, generally controlled at 16-22 ASF; refer to the attached parameter table.
d．The current for each board is calculated as A = Plating area × Current density.
6、Production Precautions:
6.1 After receiving the current indication, the production department must strictly follow the instructions to produce the first board, and the process department is responsible for supervising the production process of the first board; pay attention to check whether the data input is correct, and the theoretical current should not deviate more than 5% from the actual output, check whether the circulation filtration in the copper tank is normal, and whether the titanium basket copper particles are sufficient. After the plating is completed, the physical laboratory will slice and analyze the copper thickness of the holes and the surface copper thickness;
6.2 The physical laboratory must slice and measure when confirming the copper thickness of the FA first piece, and cannot use CMI500 for measurement. The slice must be taken from the minimum hole in the low current area unit, and only when the copper thickness of the minimum hole meets the MI requirements can it be considered that the FA first piece copper thickness is qualified;
6.3 When measuring copper thickness, the physical laboratory must refer to the process card. For all anti-oxidation boards and lead-free tin-sprayed boards, the copper thickness after plating should be increased by 2um based on the finished hole copper thickness. When doing FA, directly indicate the copper thickness requirements after plating on the FA;
6.4 Refer to the copper thickness requirements of the first board, first take 1 PNL board to make the etching first piece, and after the etching first piece is qualified, then etch all the remaining boards for the plating first piece;
6.5 The etched boards are checked by the etching QA to ensure that the line width and spacing are within the MI requirements, and to measure whether the hole diameter is too small;
6.6 After the quality department confirms the surface copper, hole copper, line width, and spacing, they will sign on the FA, and then the quality department head and ME head will review;
6.7 After the quality and ME review is completed, the FA is handed over to the plating department, which must keep it properly, and during mass production, produce according to the parameters of the FA first piece.
Note: If the FA parameters are unreasonable and lead to the first piece being unqualified, the FA must be redone until the FA is qualified before mass production can begin.
7、Attachment:Copper Plating Current Density Parameter Table (for reference, specific toFA first piece)
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Board Thickness |
Minimum Hole Diameter |
Hole Copper |
Base Copper |
Surface Copper |
Plated Area |
Current Density |
Plating Time |
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Below 0.8 |
≤0.3 |
≥20um |
H/H |
1oz |
Below 30% |
16ASF |
60MIN |
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Below 0.8 |
≤0.3 |
≥20um |
H/H |
1oz |
30-50% |
17ASF |
60MIN |
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Below 0.8 |
≤0.3 |
≥20um |
H/H |
1oz |
50% and above |
18ASF |
60MIN |
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Below 0.8 |
≥0.35 |
≥20um |
H/H |
1oz |
Below 30% |
15ASF |
60MIN |
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Below 0.8 |
≥0.35 |
≥20um |
H/H |
1oz |
30% and below |
16ASF |
60MIN |
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0.8-1.2 |
≤0.3 |
≥20um |
H/H |
1oz |
30% and below |
17ASF |
60MIN |
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0.8-1.2 |
≤0.3 |
≥20um |
H/H |
1oz |
30-50% |
18ASF |
60MIN |
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0.8-1.2 |
≤0.3 |
≥20um |
H/H |
1oz |
50% and above |
19ASF |
60MIN |
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0.8-1.2 |
≥0.35 |
≥20um |
H/H |
1oz |
30% and below |
15ASF |
60MIN |
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0.8-1.2 |
≥0.35 |
≥20um |
H/H |
1oz |
30% and below |
16ASF |
60MIN |
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0.8-1.2 |
≤0.3 |
≥20um |
H/H |
1oz |
50% and above |
19ASF |
60MIN |
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1.2-1.5 |
≤0.3 |
≥20um |
H/H |
1oz |
30% and below |
18ASF |
60MIN |
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1.2-1.5 |
≤0.3 |
≥20um |
H/H |
1oz |
30-50% |
19ASF |
60MIN |
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1.2-1.5 |
≤0.3 |
≥25um |
H/H |
1oz |
30% and below |
18ASF |
70MIN |
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1.2-1.5 |
≤0.3 |
≥25um |
H/H |
1oz |
30-50% |
19ASF |
70MIN |
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1.2-1.5 |
≥0.35 |
≥25um |
H/H |
1oz |
30% and below |
18ASF |
70MIN |
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1.2-1.5 |
≥0.35 |
≥25um |
H/H |
1oz |
50% and above |
20ASF |
70MIN |
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1.6-2.0 |
≤0.3 |
≥20um |
H/H |
1oz |
30% and below |
19ASF |
60MIN |
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1.6-2.0 |
≤0.3 |
≥20um |
H/H |
1oz |
30-50% |
20ASF |
60MIN |
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1.6-2.0 |
≤0.3 |
≥20um |
H/H |
1oz |
50% and above |
20ASF |
70MIN |
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1.6-2.0 |
≥0.35 |
≥20um |
H/H |
1oz |
30% and below |
18ASF |
60MIN |
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1.6-2.0 |
≥0.35 |
≥25um |
H/H |
1oz |
30%-50% |
19ASF |
60MIN |
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1.6-2.0 |
≥0.35 |
≥25um |
H/H |
1oz |
50% and above |
20ASF |
70MIN |