Recently,the first domestically produced silicon photonic PDK (Process Design Kit), TDK (Test Design Kit), and ADK (Assembly Design Kit) wafer service platform based on a 12-inch 40nm CMOS process line was officially launched in the Optics Valley.
This platform is operated by the National Information Optoelectronics Innovation Center (NOEIC) and marks another key breakthrough for companies in the Optics Valley in the field of silicon photonics.
It is reported that traditional chips rely on electronic data transmission, akin to trucks transporting goods, whilesilicon photonic chipsallow photons to travel through optical fibers, transforming into a “light-speed high-speed train.”
The platform innovatively constructs a silicon photonic MPW service model, integrating multiple chip designs onto the same wafer, achieving cost-sharing and significantly lowering the R&D threshold.
Silicon photonic chip from the National Information Optoelectronics Innovation Center
The platform’s silicon photonic PDK 1.0, based on a 40nm process, meets commercial requirements overall, with processing accuracy, waveguide loss, and optical coupling efficiency reaching internationally advanced levels.
In addition to the PDK, the platform also integrates TDK and ADK, providing full-process support from integrated design to packaging verification, meeting the rapid iteration needs in scientific research results transformation and product development.
Processing scene of silicon photonic chips at the National Information Optoelectronics Innovation Center
In recent years, with the maturity of technology and the explosion of AI demand, silicon photonic chips have seen large-scale applications in cutting-edge industries such as artificial intelligence and big data.
Consulting firm LightCounting predicts that by 2030, the market share of silicon photonic chips in the optical communication chip market will increase to 60%.
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