(Source: Semiconductor Industry Observation)
Previously, we discussed how local MCUs are challenging traditional giants in the market. However, at the recent Embedded Conference held in Germany, these MCUs launched leading products that showcased outstanding performance, leaving attendees in awe.
TI Releases the World’s Smallest MCU
Texas Instruments (TI) has introduced the world’s smallest MCU, further expanding its robust Arm® Cortex®-M0+ MSPM0 MCU product line. The MSPM0C1104 MCU features a wafer chip-scale package (WCSP) with an area of just 1.38mm² (equivalent to a grain of black pepper), allowing designers to maximize circuit board space in compact applications such as medical wearables and personal electronics without sacrificing performance.
TI’s MSPM0 MCU product line includes over 100 cost-effective microcontrollers, offering scalable on-chip analog peripheral configurations and various computing options, enabling engineers to enhance sensing and control in embedded designs. These devices will be showcased at Embedded World 2025 in Nuremberg, Germany, from March 11 to 13.
As consumers demand more functionality in smaller, more economical electronic devices (such as electric toothbrushes and styluses), engineers face increasing pressure to integrate advanced features without expanding circuit board sizes. To address this challenge, the MSPM0C1104 MCU leverages WCSP packaging technology, carefully selected features, and TI’s cost optimization expertise. The eight-ball WCSP package size is only 1.38mm², 38% smaller than competing solutions, enabling space-constrained designs without compromising performance.
This MCU is equipped with 16KB of memory, a three-channel 12-bit analog-to-digital converter, six general-purpose input/output pins, and supports standard communication interfaces such as Universal Asynchronous Receiver-Transmitter (UART), Serial Peripheral Interface (SPI), and Inter-Integrated Circuit (I2C). By integrating precise, high-speed analog functions into the world’s smallest MCU, engineers can flexibly maintain computational performance while keeping circuit board sizes minimal.
The MSPM0C1104 is the latest member of TI’s MSPM0 MCU product line, offering scalability, cost-effectiveness, and ease of use to accelerate product development. The product line provides pin-to-pin compatible packaging options and a range of feature sets tailored to the memory, analog, and computing needs of personal electronics, industrial, and automotive applications. The series starts at just $0.16 (for 1,000 pieces), including additional compact packaging designed to minimize circuit board space and bill of materials costs. By integrating optimization and versatility across the product line, TI enables engineers to design products of any scale while simplifying costs and system complexity.
NXP Launches S32K5 MCU Series: Pioneering Automotive Innovations with 16nm FinFET and MRAM
NXP Semiconductors has announced the launch of its S32K5 series automotive microcontrollers (MCUs), the industry’s first MCUs based on 16nm FinFET technology and featuring embedded Magnetic RAM (MRAM), marking a significant milestone. The S32K5 series is designed to extend NXP’s CoreRide platform, providing pre-integrated partitioning and electrification system solutions to support the development of scalable Software Defined Vehicle (SDV) architectures.
Automakers are increasingly adopting partitioned architectures, each with a unique approach to integrating and distributing Electronic Control Unit (ECU) functionalities. At the core of these solutions is an advanced MCU architecture that combines real-time performance with low latency, deterministic communication, and innovative isolation features.
The S32K5 series utilizes Arm® Cortex® CPU cores, operating at speeds of up to 800 MHz, delivering energy-efficient performance through advanced 16nm FinFET technology. Dedicated accelerators enhance key workloads such as network switching, security, and digital signal processing. An integrated Ethernet switch core (shared with NXP’s S32N automotive processor) ensures robust, scalable networking solutions, simplifying network design and software reuse.
To enhance security and assurance, the S32K5 MCU employs a software-defined, hardware-enforced isolation architecture. This allows automakers to implement secure partitions, ensuring the integration of safety-critical applications (up to ASIL-D) without compromising performance or reliability.
A highlight of the S32K5 is its dedicated eIQ® Neutron Neural Processing Unit (NPU), NXP’s scalable machine learning accelerator. This NPU enables efficient, real-time sensor data processing at the vehicle edge, supporting advanced AI-driven applications.
Additionally, the inclusion of high-performance MRAM significantly accelerates ECU programming times, whether during factory settings or over-the-air (OTA) updates. The write speed of MRAM is over 15 times faster than traditional embedded flash memory, enhancing automakers’ flexibility in deploying new software features throughout the vehicle’s lifecycle. Furthermore, NXP’s latest security accelerator incorporates post-quantum cryptography (PQC) capabilities, ensuring future-proof protection against emerging cybersecurity threats.
The NXP CoreRide platform represents a revolutionary advancement in the integration of automotive software and hardware. By integrating NXP’s S32 computing, networking, and system power management solutions, along with middleware, operating systems, and software from leading suppliers such as Accenture ESR Labs, ArcherMind, Blackberry QNX, Elektrobit, ETAS, Green Hills Software, Sonatus, Synopsys, TTTech Auto, Vector Informatik GmbH, and Wind River, the platform simplifies the development of next-generation SDV architectures. Additionally, collaborations with Tier 1 suppliers like Valeo and integration service providers like Foxconn further enhance its reach and capabilities.
With the S32K5 series, NXP sets a new benchmark for automotive MCUs, providing automakers with cutting-edge performance, security, and scalability for future mobility.
Microchip Launches PIC32A Series, Offering Rich Peripherals for Smart Sensing
Microchip Technology has announced the launch of its new PIC32A series, an extension of its popular PIC32 microcontroller line, designed for general-purpose projects as well as those aiming to implement machine learning and artificial intelligence (ML and AI) at the edge.
Rod Drake from Microchip stated, “The PIC32A MCU (Microcontroller Unit) is targeted at smart sensing and control applications, enhancing our existing 32-bit product line by balancing cost-effectiveness, performance, and advanced analog peripherals. High-speed peripherals and other integrated features reduce the need for certain external components, lowering system complexity while providing high-performance solutions.”
The PIC32A series operates at clock speeds of up to 200MHz, equipped with up to 16kB of static RAM (SRAM) and 128kB of program memory, both supporting error correction code (ECC), depending on the model. While the chip itself is 32-bit, it comes standard with a 64-bit floating-point unit (FPU) — designed to accelerate the performance of “compute-intensive applications” and make the chip more suitable for deploying tinyML model inference on devices.
The new chips also feature a suite of high-speed analog peripherals designed to reduce the need for external components in common sensing designs: a 12-bit analog-to-digital converter (ADC) capable of up to 40 mega-samples per second (MSps), a 12-bit digital-to-analog converter (DAC) with a high-speed 5-nanosecond comparator, and a 100MHz gain bandwidth product (GBWP) operational amplifier.
Other peripherals include three UARTs, two I2Cs, and three SPI or I2S buses, two SENT buses, eight-channel high-resolution pulse width modulation (PWM), an encoder interface, four configurable logic units, a peripheral trigger generator, and virtual remappable pins.
Renesas Launches RZ/V2N Mid-Range AI Processor Line with Integrated DRP-AI Accelerator
Leading advanced semiconductor solutions provider Renesas Electronics Corporation today launched a new device to expand its RZ/V series microprocessors (MPUs), targeting the high-capacity visual AI market. Similar to its high-end RZ/V2H device, the new RZ/V2N MPU features Renesas’ proprietary AI accelerator DRP (Dynamic Reconfigurable Processor)-AI3, achieving power efficiency of 10 TOPS/W (trillions of operations per second per watt) and up to 15 TOPS of AI inference performance. With the latest addition of RZ/V2N, the RZ/V series now spans a comprehensive market range from the low-end RZ/V2L (0.5TOPS) to the high-end RZ/V2H (up to 80 TOPS).
The new MPU is significantly smaller than the RZ/V2H, with a package area of just 15 square millimeters, reducing the required installation area by 38%. The RZ/V2N inherits the advanced features of the RZ/V series, combining high AI performance with low power consumption. These optimized features suppress heat generation, eliminating the need for additional cooling fans and reducing the size and cost of embedded systems. Developers can easily implement visual AI across various applications, from AI cameras for traffic and congestion analysis in commercial facilities to industrial cameras for production line visual inspection, and driver monitoring systems for behavior analysis.
Like the RZ/V2H, the new RZ/V2N is equipped with four best-in-class Arm® Cortex®-A55 CPU cores and one Cortex-M33 core, along with a high-quality image signal processor (ISP) Arm Mali-C55. The RZ/V2N also features a dual-channel MIPI camera interface, allowing connection of two cameras to capture images from dual angles. Compared to single-camera systems, dual-camera systems significantly enhance spatial recognition performance and enable more accurate human motion line analysis and fall detection. Additionally, dual-camera systems can capture images from different positions, efficiently counting vehicles in parking lots and recognizing license plates using just one chip.
Infineon Plans to Introduce RISC-V into the Automotive Industry with New MCU Series
Infineon Technologies plans to launch a new series of automotive microcontrollers based on RISC-V in the coming years.
This new series will become part of Infineon’s established automotive microcontroller brand AURIX and will expand the company’s existing automotive microcontroller product portfolio based on TriCore (AURIX TC series) and Arm (TRAVEO series, PSOC series).
According to Infineon, the new AURIX series will cover a wide range of automotive applications from entry-level MCUs to high-performance MCUs, exceeding the current market offerings.
Infineon will showcase a virtual prototype supported by major ecosystem partners at Embedded World 2025. This will serve as an entry kit for partners to begin pre-silicon software development.
Peter Schiefer, President of Infineon’s Automotive Division, stated, “Infineon is committed to making RISC-V an open standard in the automotive industry. In the era of software-defined vehicles, real-time performance, secure and reliable computing, as well as flexibility, scalability, and software portability are becoming more important than ever. RISC-V-based microcontrollers help meet these complex requirements while reducing automotive complexity and shortening time to market.”
Currently, Infineon holds a 28.5% share of the global automotive MCU market (Source: TechInsights: Automotive Semiconductor Supplier Market Share. 2001 to 2023). Through its joint venture Quintauris, Infineon has been collaborating with other leading companies in the semiconductor industry to accelerate the industrialization of RISC-V-based products.
Infineon is now the first semiconductor supplier to launch an automotive RISC-V microcontroller series.
To facilitate the adoption of future product lines, Infineon is working closely with its software and tool partners to establish a comprehensive ecosystem. The virtual prototype entry kit (to be showcased at Embedded World 2025) is based on tools from Infineon’s strategic partner Synopsys. It allows Infineon’s partners to begin developing software and tool products for Infineon’s RISC-V architecture before the microcontroller hardware is available.
Several partners, including IAR, Elektrobit, Green Hills, HighTec, Lauterbach, PLS, Synopsys, and Tasking, have already begun using the software development kit and will showcase their first solutions at Embedded World 2025.
More partners are expected to join in 2025. Based on their solutions, the virtual prototype will evolve into a mature digital twin of Infineon’s future microcontroller series, enabling customers to shift left in development and significantly shorten time to market.
STMicroelectronics Launches Two New MCU Series for Ultra-Low Power IoT
STMicroelectronics (ST) has announced the launch of two new generations of microcontrollers (MCUs) for IoT devices in its STM32 product line: the short-range wireless MCU STM32WBA6 for connecting industrial devices, and the ultra-low power MCU STM32U3, which can run for extended periods without maintenance.
The STM32WBA6 series is suitable for smart devices such as wearable healthcare and health monitors, animal collars, electronic locks, and remote weather sensors. Its wireless subsystem supports Bluetooth, Zigbee, Thread, Matter, and other protocols operating in the 2.4GHz band, as well as simultaneous use of multiple protocols. A single-protocol version is also available.
ST has integrated the processing core, peripherals, and subsystems to help developers simplify designs, reduce component sizes, and save on electronic bill of materials. Compared to the older STM32WBA5 series, its on-chip flash memory and RAM have been increased by up to double (2MB and 512KB). It features high-speed USB, three SPI ports, four I2C ports, three USARTs, and one LPUART.
ST employs an Arm Cortex-M33 core with a floating-point unit and DSP extensions, operating at speeds of up to 100MHz. The new STM32WBA MCU also embeds SESIP3 and PSA Level 3 certifiable security assets, such as encryption accelerators, TrustZone isolation, and random number generators, to help customers comply with upcoming RED and CRA regulations.
Meanwhile, the STM32U3 series is designed for IoT devices that can run for long periods on button batteries or environmental solar or thermoelectric power without maintenance and minimal energy requirements. ST states that the STM32 series has set a benchmark for ultra-low power MCUs; the new STM32 variant boasts “cutting-edge near-threshold chip design” for record efficiency per watt.
The so-called “near-threshold technology” operates IC transistors at extremely low voltages, saving energy. ST’s implementation uses “AI-driven” wafer-level adaptive voltage scaling to compensate for foundry process variations. In addition to dynamic energy savings (as low as 10µA/MHz), the STM32U3 series achieves extremely low stop currents of just 1.6µA.
The STM32U3 MCU embeds up to 1MB of dual flash and 256kB of SRAM, along with the same security features as the STM32U5, and adds key storage capabilities. Typical applications include smart water meters and gas meters, certain healthcare devices (blood glucose meters, insulin pumps), and other sensors and monitors for animal care, forest fire detection, and environmental monitoring in industrial settings. It is also suitable for certain consumer products.
Both MCU series are now available, with prices starting at $2.50 for 10,000 pieces for the STM32WBA6 and $1.93 for the STM32U3.
Patrick Aidoune, head of the company’s “general-purpose” MCU division, stated, “Powerful and standardized wireless connectivity is at the core of IoT. Our new STM32WBA6 MCU offers richer features and greater memory to meet the high-end applications in smart homes, healthcare, factories, and agriculture. Our customers can now accelerate development to meet the demand for new products in consumer and industrial markets that deliver more functionality and stronger performance within smaller size and power constraints.
“The STM32U3 series inherits the tradition of STMicroelectronics’ well-known ultra-low power general-purpose microcontroller series, opening the door for the widespread adoption of smart technologies in various environments. With innovations like the latest advancements in near-threshold design, the new devices minimize dynamic power consumption, achieving twice the efficiency compared to previous generations, thus contributing to corporate sustainability goals.”