Development and Value Evolution of the Global Edge AI Industry
Edge AI refers to deploying AI models at the edge nodes close to the data generation sources, especially in AI consumer electronics and automotive fields, ensuring localized completion of data collection, processing, inference, and decision-making. Through a collaborative model of cloud training and edge deployment, it allocates computing power to the network edge layer, forming an intelligent architecture with local real-time response and cloud collaborative optimization. This shift enables real-time processing, enhanced privacy protection, and greater operational independence without continuous reliance on the cloud.
To support these capabilities, edge AI devices require higher actual processing performance in a compact form. This, in turn, imposes stricter requirements on core hardware components, especially PCBs.
In the early 21st century, personal computers and smartphones, as representatives of consumer electronics, first achieved technological breakthroughs, relying on innovations in mobile computing and touch interaction technology, driving the popularization of intelligent products. Subsequently, with continuous technological upgrades, smart wearables, tablets, XR devices, gaming consoles, and smart home products emerged. At the same time, the automotive industry is undergoing profound changes in electrification and intelligence, evolving from traditional transportation tools into edge AI devices that integrate travel, work, and entertainment functions, reshaping mobile lifestyles.
Global Market Size of Edge AI Devices
The commercialization of edge AI technology is becoming a core factor driving the upgrade and value reshaping of the edge AI device industry. Edge AI devices mainly include AI consumer electronics terminals, automotive terminals, industrial terminals, and medical devices. On one hand, in the AI consumer electronics sector, the new hardware replacement cycle and the increase in product value further drive market growth; on the other hand, edge AI is a key technology for achieving ADAS and intelligent cockpit human-machine co-driving, promoting the evolution of automobiles from transportation tools to mobile intelligent spaces. According to shipment statistics, the global shipment of edge AI devices is expected to reach approximately 360 million units by 2024, and by 2029, the global shipment of edge AI devices will reach 2 billion units, with a compound annual growth rate of 40.7% from 2024 to 2029.
As edge AI devices continue to innovate, they will have more new functions and application scenarios, driving the form and performance of electronic components at the terminals, as well as increasing their unit prices. In terms of shipment volume, AI smartphones, personal computers, and tablets are the three largest categories of edge AI devices. The penetration rates of AI-enabled models in various product segments are expected to be as follows: for smartphones, the penetration rate will increase from 13.2% in 2024 to 59.4% in 2029; for tablets, the penetration rate will rise from 20% in 2024 to 67.0% in 2029; and for personal computers, the penetration rate will grow from 18.6% in 2024 to 72.0% in 2029.
Global PCB Industry Market Size for Edge AI Devices
The global PCB industry for edge AI devices, as the core carrier supporting edge node AI computing, is rapidly expanding in market size with the explosive demand for edge computing power. The global edge AI device PCB market is part of the entire global PCB market, corresponding to the PCB market size deployed in edge AI devices. It is an important driver for future growth in the global PCB market, and its market share is steadily increasing.
By 2024, the global PCB industry for edge AI devices is expected to exceed $9.8 billion, with a compound annual growth rate of 62.5% from 2019 to 2024. Looking ahead, benefiting from the penetration of generative AI in edge scenarios and the acceleration of edge AI deployment, the market is expected to enter a high-growth period, with the edge AI device PCB market size projected to increase to $31.7 billion by 2029, with a compound annual growth rate of 26.4% from 2024 to 2029, significantly higher than the overall growth rate of the global PCB industry.
Driving Factors and Development Trends of the Global PCB Industry for Edge AI Devices
• AI is Shifting to the Edge: The application of AI is shifting to the edge, driving the demand for high-performance, low-latency PCBs in intelligent scenarios such as consumer electronics. Specifically, as AI-driven edge computing power deployment accelerates: in the smart automotive sector, the iteration of ADAS, intelligent cockpit, and vehicle networking functions imposes higher requirements for high-frequency, high-temperature reliability, and long-term stability of automotive PCBs; in the consumer electronics industry, massive terminal devices need to achieve localized real-time data processing and decision-making, leading PCBs to evolve towards high-density integration, low signal loss, and miniaturization. In the future, with the development of communication technology, the collaboration between edge and data centers will deepen, and PCBs will continue to upgrade towards high-frequency, high-speed, high-heat dissipation, and high reliability.
• Continuous Innovation in Consumer Electronics Products: Consumer electronics are continuously innovating under the drive of AI technology, collectively promoting the development of the global PCB industry for edge AI devices from three aspects: performance, form, and functionality.
First, performance improvements drive PCBs to evolve towards high-end. Devices need to be equipped with stronger processors to support local AI computing, which requires PCBs to have higher layer counts, low-loss high-speed materials, and more precise wiring processes, such as advanced HDI and substrate-like materials (SLP).
Second, miniaturization of form promotes the development of PCBs towards high density and flexibility. To adapt to compact structures such as foldable screens and wearable devices, PCBs must achieve higher integration within a smaller area, leading to the widespread adoption of arbitrary-layer HDI and flexible board technologies.
Third, diversification of functions brings upgrades in PCB heat dissipation and integration. Complex functions such as multi-sensor fusion require PCBs to use special materials like metal substrates and introduce system-level packaging technologies to ensure stable operation.
In summary, the trends of intelligence, thinness, and multifunctionality in consumer electronics driven by AI continuously promote the upgrading of edge AI PCBs in materials, design, and processes, injecting strong growth momentum into the industry.
• Strong Demand in Automotive Scenarios Drives Significant Growth in the PCB Market: The automotive sector has become a core demand scenario for the entire market. With the accelerated penetration of L3-L4 level autonomous driving technology, it is expected that by 2025, its penetration rate will exceed 55%, driving the increase in PCB value per vehicle; among them, the unit price of edge AI device PCBs used in millimeter-wave radar modules is more than three times that of ordinary automotive PCBs, highlighting the critical position and high added value of high-end automotive PCBs in autonomous driving systems.
As the complexity of autonomous driving functions continues to upgrade, the system imposes higher requirements on the signal transmission stability, high-temperature performance, and electromagnetic interference resistance of edge AI device PCBs. This trend is prompting the industry to increase R&D investment, driving products towards multi-layer, high-frequency, and high-speed iterations. At the same time, the rapid popularization of EVs and intelligent connected vehicles is driving continuous growth in demand for edge AI device PCBs, and it is expected that the market size in this field will further expand in the future.
• Leading Companies Strengthen Market Position through Capacity Expansion and Mergers and Acquisitions: The technological barriers and capital investment thresholds in the edge AI device field are continuously increasing, raising higher requirements for companies’ comprehensive capabilities across devices and downstream markets. Leading companies are further strengthening their market position through capacity expansion and mergers and acquisitions. Specifically, edge AI application scenarios encompass various devices such as consumer electronics and automobiles, with significant differences in performance standards, reliability, and customization requirements for PCBs across different fields.
Companies need to possess cross-domain technical adaptation capabilities, including the application of high-frequency and high-speed materials, high-density interconnection processes, thermal management solutions, and soft-hard combined board design, to meet the stringent requirements for computing power support and signal integrity in different scenarios. At the same time, the construction of high-end production lines and the scale of R&D investment are continuously expanding, with capital expenditures related to high-end testing equipment, precision processing systems, and automated production lines significantly increasing, further raising the entry and operational thresholds for the industry.
In this context, leading companies consolidate their competitive advantages through the following strategies: on one hand, they continuously promote the global layout of high-end capacity targeting core high-growth areas to strengthen large-scale delivery capabilities; on the other hand, through strategic mergers and acquisitions, they rapidly acquire key technology patents, complementary product lines, and high-value customer resources, achieving cross-domain synergy and market share expansion. This trend accelerates the concentration of industry resources towards leading companies with comprehensive technology, financial strength, and broad customer coverage.
For more industry research and analysis, please refer to the official website of Sihan Industry Research Institute, which also providesindustry research reports, feasibility reports (project approval, bank loans, investment decisions, group meetings), industrial planning, park planning, business plans (equity financing, investment promotion, internal decision-making), special research, architectural design, and overseas investment reports and other related consulting service solutions.
About Us 
Sihan Industry Research Institute Chinasihan.comLeader in Chinese Industry ResearchInnovating for the Future CityCustomized contact information for report orders: · Contact Number:4008087939 0755-28709360· Customer Service WeChat:g15361035605 · Customer Service QQ:454058156· Email:chinasihan@126.com
· Official Website: Chinasihan.com