Year: 2025

Interpretation of Semiconductor Wafer Fabrication Location as Origin Policy: Significant Tariff Impact on US IDM Products

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Interpretation of Semiconductor Wafer Fabrication Location as Origin Policy: Significant Tariff Impact on US IDM Products

Event: On April 11, the China Semiconductor Industry Association issued an “Emergency Notice on the Origin Certification Rules for Semiconductor Products.” According to the relevant regulations of the General Administration of Customs, the origin of “integrated circuits” is determined based on the four-digit tariff number change principle, meaning that the wafer fabrication location is recognized … Read more

New Regulations on Semiconductor Origin Certification! A Comprehensive Analysis of Chip Tape-out

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New Regulations on Semiconductor Origin Certification! A Comprehensive Analysis of Chip Tape-out

On April 11, 2024, the China Semiconductor Industry Association issued an “Emergency Notice on Clarifying the Certification Rules for the Origin of Semiconductor Products” (Zhongbanxie [2024] No. 12) to the entire industry. This document addresses the current disputes over the traceability of the semiconductor supply chain in the context of international trade frictions and establishes … Read more

Refinement of the ‘Wafer Fab’ Rules for Countermeasures Against U.S. Semiconductor Tariffs

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Refinement of the 'Wafer Fab' Rules for Countermeasures Against U.S. Semiconductor Tariffs

This article only summarizes the latest fundamentals of companies and the industry, and does not recommend buying or selling stocks at this time. This article does not provide individual stock operation guidance; investment carries risks, and one should be cautious when entering the market. . Customs Standard Update: U.S. Imported Chips Based on Wafer Fab … Read more

China’s Chip War Takes a Stunning Turn: New Rules on Chip Origin Break Through the 145% Tariff Barrier

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China's Chip War Takes a Stunning Turn: New Rules on Chip Origin Break Through the 145% Tariff Barrier

Your smartphone has suddenly become a battleground for international political games. Just last Friday, the China Semiconductor Industry Association issued an “Emergency Notice on the Origin Certification Rules for Semiconductor Products,” directly overturning the global chip industry’s playing field. How severe is this? The U.S. has just slapped a 145% tariff on chips made in … Read more

Refinement of the ‘Wafer Fab’ Rule for Countermeasures Against U.S. Semiconductor Tariffs

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Refinement of the 'Wafer Fab' Rule for Countermeasures Against U.S. Semiconductor Tariffs

Customs Standards Update: U.S. Imported Chips Based on Wafer Fab Standards, with a Focus on Analog Chips On the morning of April 11, the China Semiconductor Industry Association issued a statement, stating that according to the relevant regulations of the General Administration of Customs, the origin of “integrated circuits” is determined based on the four-digit … Read more

New Regulations on Chip Origin in China: Cutting Global Supply Chains with ‘Wafer Fabrication Location’

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New Regulations on Chip Origin in China: Cutting Global Supply Chains with 'Wafer Fabrication Location'

The China Semiconductor Industry Association announced on April 11 a notification regarding the rules for determining the origin of integrated circuits, clearly stating that the ‘wafer fabrication location’ will be considered as the origin. Coupled with China’s adjustment of import tariffs on American goods to 125%, there is a hidden strategy behind this move! 1. … Read more

Navigating the 104% Tariff Pressure from the U.S.: The Path Forward for Silicon Carbide Wafer Manufacturers (As of April 2025)

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Navigating the 104% Tariff Pressure from the U.S.: The Path Forward for Silicon Carbide Wafer Manufacturers (As of April 2025)

Introduction to Senhui: Suzhou Senhui Semiconductor, supported by a strong research and technology team, focuses on providing comprehensive process solutions and wafer processing services for global compound semiconductor customers. The team members have years of experience in the semiconductor industry, possessing decades of rich capabilities in photolithography, thin film processes, epitaxy, bonding processes, as well … Read more

Successful Tape-Out of Loongson’s New Processor

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Successful Tape-Out of Loongson's New Processor

Recently, the Loongson 2K3000 processor (also known as 3B6000M) successfully completed its tape-out, and has undergone preliminary functional and performance evaluations, with all indicators meeting the expected targets. The Loongson 2K3000 and 3B6000M are based on the same silicon wafer but utilize different packaging forms, designed respectively for industrial control applications and mobile terminal markets. … Read more

Understanding PCBA Contract Manufacturing and Material Sourcing

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Understanding PCBA Contract Manufacturing and Material Sourcing

Are you puzzled by the new term “PCBA Contract Manufacturing and Material Sourcing”? Today, we will unveil the meaning of this “new term.” PCBA contract manufacturing and material sourcing can generally be understood from two perspectives: The narrow definition of PCBA contract manufacturing and material sourcing refers to the provision of PCB boards, electronic component … Read more

Storage Period and Storage Standards for PCBA Products

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Storage Period and Storage Standards for PCBA Products

Core Competitiveness of Flexible Response and Fast Delivery“Click the blue text to follow us”2023 With the acceleration of electronic product iterations, PCBA (Printed Circuit Board Assembly) as a core component, its storage conditions and preservation period directly affect product reliability. Hengtian Yi relies on years of electronic manufacturing experience, combined with industry standards and technical … Read more