Shijia Photonics (SH:688313) primarily produces PLC optical splitter chips, AWG chips, VOA chips and device modules, OSW chips, WDM devices and modules, optical fiber connector jumpers, FP laser chips, DFB laser chips, EML laser chips, indoor optical cables, and polymer materials for cables. The products applied in AI data centers include: 4CH AWG wafer chips … Read more
Recently, the escalating US-China tariff war has become the core battleground of the economic strategic game between the two countries.In the short term, the US-China tariff war will accelerate the decoupling of technology and industrial chains, impacting domestic manufacturers that rely on US technology and chips. In the long run, the tariff war is beneficial … Read more
In the previous issue, we introduced the wafer preparation process (link). Silicon ingots and wafers Today, we will continue discussing the manufacturing process of chips (die). This stage is the most challenging part of the chip manufacturing process. I will try to explain it in a simple and understandable way, and I hope everyone can … Read more
By Reporter Li Cong from the New Beijing News Editor 丨Chen Xiaoshu Proofreader 丨Yang Li ► This article has 5706 words and takes about 10 minutes to read. Under the shadowless lamp, the scalpel steadily cuts open the skin 1 centimeter below Yuan Qizhi’s navel, about the width of a finger. Ten white pills, the … Read more
Recently, at the 2025 Shanghai International Auto Show, Intel held a technology launch event, officially introducing the second-generation AI-enhanced Software Defined Vehicle (SDV) system-on-chip (SoC) — the world’s first automotive chip utilizing a multi-process node Chiplet architecture, showcasing Intel’s ambition in the smart vehicle sector.On that day, Intel also announced a strategic partnership with industry … Read more
Apr. Click the blue text to follow us 2025.04 Introduction:China Resources Microelectronics is transforming from a local power device manufacturer into a system-level supplier with both product strength and platform capabilities. The Chinese semiconductor industry has developed over several decades, evolving from nothing to a robust sector, giving rise to a number of outstanding local … Read more
According to exclusive reports from Caijing, China’s import tariff exemptions for 8 semiconductor/integrated circuit-related tariff codes have officially come into effect, involving key equipment and materials for chip design, packaging, and testing. This move will directly reduce costs for enterprises, but storage chips (such as DRAM and NAND) are still excluded from the list, sparking … Read more
1. Introduction In the semiconductor industry, every breakthrough in process technology is akin to a technological revolution, redefining the boundaries of chip performance and injecting powerful vitality into the fields of intelligent electronic devices and high-performance computing. On April 24, 2025, TSMC officially announced at the 2025 Technology Symposium in the United States that its … Read more
1. What is BIOS The term BIOS first appeared in 1975, and it stands for Basic Input Output System. It truly gained prominence with the launch of the IBM PC in 1981, marking the beginning of a tumultuous history. The IBM PC system generally consists of three parts: hardware, software, and the middleware BIOS, with … Read more
Chip mounting is a core process in semiconductor packaging, and the choice of technology directly affects the thermal management, electrical performance, and long-term reliability of devices. This article systematically analyzes the process characteristics and applicable scenarios of four mainstream mounting technologies and discusses industry development trends. For more common topics, click above to follow and … Read more