PCBEngineers often find multilayer circuit boards confusing at first glance, especially with layers reaching ten or more, resembling a spider web.Below are several internal structure diagrams of multilayer PCBs, showcasing various stacking structures in a three-dimensional format. 01 The core of High-Density Interconnect (HDI) boards lies in the vias. The processing of multilayer PCB traces … Read more
There are two methods for manufacturing multilayer boards: the electroplated via method and the high-density lamination method, both of which achieve circuit board structures through different combinations of processes. Currently, the most commonly used method is the electroplated via method, which has developed and improved over more than half a century. In terms of equipment, … Read more
(There are benefits at the end of the article, don’t miss out!) As electronic devices develop towards higher performance and smaller sizes, the precision and performance requirements for PCBs are also increasing. High multilayer PCBs can provide more routing layers, allowing for more complex and dense circuit designs, thus meeting the demands for high-frequency and … Read more