For the layout of SMT components with small pin pitches such as QFP, QFN, and SOP, we sometimes encounter situations where adjacent pins of these components need to be interconnected. It has been observed that many designers, in an effort to save time, directly route the connection between the pads, effectively shorting the pins together. As shown in the figure below:
Directly shorting the pins together in the middle of the pads does not pose any electrical connection issues; however, it can lead to problems during SMT quality inspection. As illustrated in the following image, after SMT, the shorted pin leads exhibit solder paste bridging, which may mislead SMT quality inspectors into thinking there is a soldering defect.
The correct approach is to pull out a short trace from one pad and then connect it to another pad, achieving the short connection outside the pads. As shown in the figure below:
