1. Basic Structure of I/O Units The I/O PAD is a critical part of the chip that connects to external circuits, typically consisting of bonding pads, circuits, power lines, and ground lines. The bonding pad (PAD) is used to connect the chip to the package substrate via gold wires, usually shaped as rectangles measuring several … Read more
On May 22, 2025, Xiaomi’s 15th anniversary strategic new product launch conference introduced several products, including the long-awaited first SUV, the Xiaomi Yuqi 7, the first self-developed chip, the Xuanjie O1, the Xiaomi 15S Pro equipped with the Xuanjie O1, the Xiaomi Pad 7 Ultra, the Xiaomi Watch S4, and an all-around lightweight flagship designed … Read more
According to reports from Electronic Enthusiasts (by Zhang Ying), in the first quarter of 2025, the open-source of large model technology represented by Deepseek has brought disruptive changes to the development of edge and endpoint AI applications. With the significant reduction in the development threshold for AI at the endpoint, and thanks to advantages such … Read more
In today’s era of explosive demand for intelligent driving and immersive interaction, chip performance has become a core element defining user experience. This article takes the Qualcomm Snapdragon 8295 as an example to deeply analyze how to establish reasonable performance reference indicators for chips. Focusing on six key scenarios—high-precision 3D graphics rendering, global 3D HMI … Read more
Before reading this article, please click the blue text above“Mobile Daily”, then click“Follow”, so you can continue to receive the latest articles for free. Daily shares are available.It’s completely free to subscribe, please follow in time Recently, tech news has left many netizens confused—TSMC’s heavy investment in 2nm technology has suddenly been rejected by Apple … Read more
Click the blue text to follow us WINTER This is a very detailed analysis of the powerful performance exhibited by Junzheng’s series of chips in various fields, with detailed analysis of models such as T10, T21, T23, T40, and A1. For more detailed specifications, please check with us! 1. T10 Chip The T10 integrates XBurst, … Read more