In-Depth Analysis of Chip I/O Units in SoC Chip Design

In-Depth Analysis of Chip I/O Units in SoC Chip Design

1. Basic Structure of I/O Units The I/O PAD is a critical part of the chip that connects to external circuits, typically consisting of bonding pads, circuits, power lines, and ground lines. The bonding pad (PAD) is used to connect the chip to the package substrate via gold wires, usually shaped as rectangles measuring several … Read more

How Engineers Distinguish Power Management IC Models

In electronic circuits, Power Management Integrated Circuits (PMICs) are crucial core components responsible for voltage conversion, battery charging and discharging, overload protection, and other essential functions. However, with hundreds of PMIC models available, how can engineers differentiate between them? 1. Silkscreen Decoding ① Brand Logo Identification TI (Texas Instruments) TPS/LM series, ADI (Analog Devices) LT/ADP … Read more