Embedded Hardware

 

  • System on Modules (SoM)
  • Single Board Computers (SBC)
  • Development Boards
  • Industrial PCs & Embedded Computers
  • IoT & Edge Computing Gateways
  • AI & Machine Learning Modules
  • Rugged & Industrial-Grade Components
  • Peripherals & Expansion Modules (Displays, Sensors, Power Modules)

Detailed Specifications of T618(UMS512T)/T610(UMS512)/T310(UMS312) Android Core Board – Unisoc Platform Solutions

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Detailed Specifications of T618(UMS512T)/T610(UMS512)/T310(UMS312) Android Core Board - Unisoc Platform Solutions

The T618(UMS512T)/T610(UMS512)/T310(UMS312) platform is an industrial-grade high-performance 4G smart module capable of running the Android operating system. It supports various standards including TDD-LTE/LTE-FDD/WCDMA/TD-SCDMA/CDMA2000/GSM; supports WiFi 802.11a/b/g/n/ac, BT5.0 LE for short-range wireless communication, and supports GPS/GLONASS/Galileo/Beidou satellite positioning; it supports various voice and audio codecs, and integrates a Mali-G52 3EE 2Core high-performance graphics engine, enabling smooth … Read more

Renesas Launches DA14533, Revolutionizing Automotive Bluetooth Connectivity

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Renesas Launches DA14533, Revolutionizing Automotive Bluetooth Connectivity

Renesas Electronics has launched its latest innovative product, the DA14533—a groundbreaking automotive-grade Bluetooth Low Energy (LE) System on Chip (SoC) designed to enhance wireless connectivity in automotive and industrial applications. This advanced chip is suitable for a variety of uses, including tire pressure monitoring, keyless entry systems, wireless sensors, and battery management solutions. The DA14533 … Read more

Expert Insights: An Interview with Renesas Electronics’ Chief Timing Officer on the Current State of Clock IC Technology

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Expert Insights: An Interview with Renesas Electronics' Chief Timing Officer on the Current State of Clock IC Technology

Zaher Baidas Vice President and General Manager of the Renesas Timing Product Division Clocks lay the foundation for the operation of every electronic device. Clock-synchronized data signals are often referred to as the metronome of the chip industry, ensuring system reliability. However, today’s timing products are no longer just about maintaining the rhythm of a … Read more

Renesas Enhances Edge Computing with New AI-Enhanced Reconfigurable Processor

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Renesas Enhances Edge Computing with New AI-Enhanced Reconfigurable Processor

Renesas Electronics Corporation has expanded its microprocessor (MPU) lineup with a cutting-edge innovation: the RZ/V2N. This groundbreaking MPU, launched at the 2025 Embedded World Conference, integrates a powerful artificial intelligence accelerator and reconfigurable processing capabilities, promising to enhance the landscape of edge computing. The core of the RZ/V2N features an impressive architecture with four Arm … Read more

Countermeasures for Touch Button Noise from Renesas

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Countermeasures for Touch Button Noise from Renesas

Touch button products are widely used in more and more products due to their aesthetic appeal, ease of use, and easy cleaning. The scenarios in which they are used are also increasing, and the reliability of touch buttons in complex external environments is receiving greater attention. This article focuses on the characteristics of Renesas products … Read more

Young Innovator Creates Affordable Drone Using Chopsticks, Receives 130,000 Likes!

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Young Innovator Creates Affordable Drone Using Chopsticks, Receives 130,000 Likes!

Reporter: Liang YajiaNews Hotline: 0771-5690127Tip-off Email: [email protected] Recently, A young man from Dezhou, Shandong, born in the 1990s, named Zhao posted a video of a drone he made using chopsticks as the body, which attracted the attention of netizens. The drone costs only a few dozen yuan, and Zhao completed it in just 3 days … Read more

Advancements in GaN Technology II: The First 100nm High-Performance GaN Wafer PDK Platform in China

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Advancements in GaN Technology II: The First 100nm High-Performance GaN Wafer PDK Platform in China

Jiufengshan Laboratory GaN PDK R&D Team Jiufengshan Laboratory GaN Series Achievements II Recently, Jiufengshan Laboratory released the first 100 nm silicon-based GaN commercial Process Design Kit (PDK) in China, with performance indicators reaching domestic leading and international top levels. As the second commercial solution globally and the first in China, its technical specifications support high-throughput … Read more

New Breakthrough! Zhuhai Company Successfully Tapes Out Its First Ultra-Performance AI Chip with Integrated Storage and Computing

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New Breakthrough! Zhuhai Company Successfully Tapes Out Its First Ultra-Performance AI Chip with Integrated Storage and Computing

Recently, Zhuhai High-tech Zone high-tech enterprise Zhuhai Haoze Technology Co., Ltd. (referred to as “Haoze Technology”), has made significant progress in edge intelligent technology, and its self-developed first ultra-performance integrated storage and computing AI chip VVT300 has successfully taped out. This groundbreaking achievement opens up new avenues for the commercial application of its AI chips. … Read more

Technical Insights from Silicon Carbide Wafer Manufacturers: A Comprehensive Analysis of Hybrid Bonding

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Technical Insights from Silicon Carbide Wafer Manufacturers: A Comprehensive Analysis of Hybrid Bonding

Introduction to Senhui: Suzhou Senhui Semiconductor, supported by a strong research and technical team, focuses on providing complete process solutions and wafer services for global compound semiconductor customers. The team members have deep experience in the semiconductor industry, with decades of rich capabilities in photolithography, thin film processes, epitaxy, bonding processes, as well as etching, … Read more

Wafer Processing Manufacturer Shares: Detailed Explanation of 2.5D/3D Packaging PPT

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Wafer Processing Manufacturer Shares: Detailed Explanation of 2.5D/3D Packaging PPT

Company Overview: Suzhou Senhui Semiconductor, supported by a strong research and technology team, focuses on providing complete process solutions and wafer processing services for global compound semiconductor customers. The team members have been deeply involved in the semiconductor industry for many years, possessing decades of rich experience in photolithography, thin film processes, epitaxy, bonding processes, … Read more