Wald Research Feedback: Diamond Heat Dissipation + PCB Diamond Micro Drill
#Diamond Micro Drill: Diamond micro drills can be divided into coated and pure diamond micro drills. The company is focusing on pure diamond micro drills, which currently cover diameters from 0.08 to 3.00 mm. For example, with single crystal silicon, each micro drill can process 6,000 to 10,000 holes, while on silicon carbide, it can achieve a lifespan of 220 to 600 holes. With outstanding performance in hole position accuracy, hole wall smoothness, and processing efficiency, diamond micro drills have attracted the attention of major downstream PCB manufacturers. Currently, they are undergoing SN verification, and if breakthroughs occur, other major manufacturers will follow suit.
#Diamond Heat Sink: The thermal conductivity of natural diamond material reaches 2000 W/(m·K), which is about five times that of copper, and it has a low thermal expansion coefficient. For 12-inch silicon carbide crystal growth, diamond products have a thermal conductivity of 800-1000 W/m·K. Currently, only Wald can provide such products domestically, initially designed as a thermal uniformity product (thickness of 50 microns), but customers are now requesting a thickness of 300 microns with one side polished and the other side featuring microchannels. Large-sized heat sink plates, with self-made equipment, represent a core technological barrier.
#We believe that diamond heat dissipation is a breakthrough point for the cooling of computing chips after reaching the critical point of traditional materials, and we will continue to monitor the industrialization progress of domestic manufacturers.