Development History of Jingwang Electronics
In 1993, Jingwang was established in Nanshan, Shenzhen.
In 2004, it entered the FPC field.
In 2008, the Longchuan factory was put into production; in 2010, the MPCB factory was put into production; in 2013, the first FPC factory was put into production.
In 2014, the first factory in Jiangxi was put into production, and in 2018, the second factory was put into production.
In 2017, it went public.
In 2021, the SLP division and HLC at the Zhuhai Jinwan base were put into production; the second Longchuan FPC factory was put into production, and MPCB expanded production.
In 2022, a major breakthrough was achieved in the 14-layer Anylayer project, gaining recognition from major AR/VR manufacturers.
In 2025, an expansion of 5 billion will be made at the Zhuhai Jinwan base to enhance the capacity and technical capabilities of high-end HDI (including SLP, with an annual output of 600,000 square meters) and HLC (with an annual output of 1.2 million square meters).
HLC (High Layer Count, high multi-layer circuit board): Typically refers to multi-layer circuit boards with more than 18 layers, capable of meeting the high-density wiring requirements of complex systems. HLC boards have many layers, and their dimensions are generally larger, especially for server and communication HLC boards, which can exceed 0.5 meters.
SLP (Substrate-like PCB): Can be seen as a further upgrade of HDI, with finer line widths and spacings, almost approaching semiconductor-level precision, generally reducing line width/spacing from HDI’s 40/50 microns to 20/35 microns. The SLP process is closer to that used for semiconductor packaging IC substrates, but has not yet reached the specifications of IC substrates, mainly applied in high-end mobile devices, AI chip packaging, smartphones, etc., suitable as a packaging carrier for SIP (System in Package).
Product Layout of Jingwang
Includes thick copper boards, high-frequency high-speed boards, double-sided/multi-layer FPC boards, high-density FPC boards, HDI boards, metal-based circuit boards, rigid-flex boards, packaging substrates, substrate-like boards, etc.
Core Competitiveness of Jingwang
World’s largest automotive PCB supplier.Stable mass production of automotive lidar boards, millimeter-wave radar boards (5th and 6th generation), domain controllers, cameras, high-voltage charging platform PCBs, etc.Technologies for 7th generation millimeter-wave radar boards, steer-by-wire products, and motor drive embedded power device products are accelerating introduction and small batch production for multiple automotive projects with higher levels of intelligent driving and integration.
In the first half of 2025, mass production in the AI server field accelerated, with high-density high-end HDI capabilities improving smoothly, and related solutions/products meeting the high standards of internationally leading customers; the shipment volume of 800G optical modules increased, with stable mass supply to several leading optical module customers.