Hot News
Samsung is set to launch AI audio glasses on September 29.
According to reports, Wang Minjie, Chief Application Scientist at AWS Shanghai AI Research Institute, announced on social media that they received notification that the AWS Shanghai AI Research Institute (the last overseas research institute of AWS) has officially been dissolved.
It is reported that Samsung will hold its third Unpacked event for 2025 in South Korea on September 29, where it will unveil the Galaxy Z TriFold, a foldable smartphone. At the same time, the company will also release its Project Moohan mixed reality (MR) headset and AI smart glasses.
Samsung seems ready to challenge Ray-Ban Meta with its own smart glasses. Reports indicate that Samsung’s version will be a purely audio device powered by Qualcomm’s AR1 chip and is likely to run on the Android XR operating system.
Meta currently holds a dominant position with Ray-Ban Meta, and rumors clearly indicate that we will see a significant update at this month’s Meta Connect event, where Meta may add a display module to the new smart glasses.
UBTECH secures a 250 million order
UBTECH has once again set a record by securing a procurement contract worth 250 million yuan for humanoid robot products and solutions from a well-known domestic enterprise.
The contract primarily involves the humanoid robot Walker S2 (which features an autonomous hot-swappable battery system), and UBTECH will initiate delivery under this contract within this year. This is currently the largest contract for humanoid robots globally.
According to publicly available data, as of now, the UBTECH Walker series humanoid robots have secured contracts worth nearly 400 million yuan (including nearly 50 million yuan in humanoid robot orders delivered in H1), not including the orders for the full-size research and education humanoid robot Tian Gong Xing Zhe launched in March this year in collaboration with the Beijing Humanoid Robot Innovation Center.
Currently, UBTECH has partnered with well-known companies in the fields of new energy vehicle manufacturing, 3C manufacturing, and smart logistics, including BYD, Dongfeng Liuzhou Automobile, Geely Automobile, FAW-Volkswagen Qingdao Branch, Audi FAW, BAIC New Energy, Foxconn, and SF Express. The industrial humanoid robot Walker S series has entered the most factories globally for practical training. In July of this year, UBTECH released the new generation humanoid robot Walker S2, which not only features the world’s first autonomous battery swapping technology for 24/7 uninterrupted operation but also incorporates the iterative BrainNet 2.0, a self-developed intelligent technology specifically for industrial humanoid robots, achieving AI dual circulation and enabling spiral evolution of individual and collective collaboration of humanoid robots. Through practical training in real scenarios, UBTECH’s humanoid robots are making rapid progress and have gained recognition and orders from customers.
Industry Dynamics
Guo Mingji: Vision Air is expected to be released in 2027, with a price reduction of 50%
Recently, overseas renowned supply chain analyst Guo Mingji mentioned the latest progress of Apple’s lightweight headset Vision Air in his analysis report, with the main content as follows:
Apple is expected to launch Vision Air in 2027, which will address the high weight and high price issues of Vision Pro. The new device is expected to weigh over 40% less and cost over 50% less.
Vision Air’s shipment volume is expected to reach 1 million units by 2027 (the current model’s shipment volume is less than 400,000 units).
GIS is currently responsible for the lamination of the existing Vision Pro and its upcoming M5 version (expected to be launched in the second half of 2025) and will subsequently replace the current supplier to become the sole supplier of Vision Air Pancake lenses.
East Core Technology: Lishuan Technology is sending samples to some customers
On September 3, East Core Technology stated on the interactive platform that Lishuan Technology has sent samples to some customers and is continuously optimizing, and will continue to advance product production, sales, and other related work as planned.
According to information, Lishuan Technology was established in 2021 and is a company developing high-performance GPUs, focusing on self-developed architectures and proprietary intellectual property, with deep expertise in the architecture, design, software development, and know-how of large GPU chips, as well as experience in processor ecosystem conditions and ecosystem construction.
The 7G100 chip from Lishuan Technology has undergone nearly four years of R&D and successfully lit up on May 25, 2025. The main functional test results meet expected requirements, and the product can cover mainstream graphics rendering and AI acceleration needs in edge, cloud, and edge scenarios, achieving seamless compatibility with mainstream GPU architectures, with the core goal of breaking through the challenges of self-controllable mainstream complete GPU architecture in China.
Recently, East Core Technology also announced an investment and related transaction announcement, stating that it plans to jointly invest 500 million yuan in Lishuan Technology with investors such as Hengtong Group and funds under Shanghai Daohua. East Core Technology will subscribe to the newly registered capital with approximately 211 million yuan of its own funds, and after the transaction is completed, its shareholding ratio will be slightly adjusted from 37.14% to 35.87%, still making it an important shareholder of Shanghai Lishuan. This move marks East Core Technology’s further deepening of investment in the GPU field within its integrated strategy of “storage, computing, and networking.”
Wantong Intelligent Control: Fellow 1 chip samples to be sent in October, tape-out in Q1 2026
On September 3, Wantong Intelligent Control stated in the investor relations activity record that the R&D design of the Fellow 1 chip has been basically completed, and samples are expected to be sent out in October. The first version of the chip has been basically completed, and further optimization will be made based on testing results. The company has established a special team to collaborate with Deep Ming Aosi on R&D and product application development. It is expected that preliminary testing and feedback will begin in October with FPGA solutions for robot manufacturers and automotive factories.
From a timeline perspective, the Fellow 1 chip is expected to tape out in Q1 2026, with the chip returning in Q2 2026.
When asked about the reasons for collaborating with Wantong Intelligent Control, Deep Ming Aosi’s chairman Zhang Qiang stated that first, Deep Ming Aosi needs a partner with good profitability, and Wantong Intelligent Control has consistently maintained a high gross margin; second, Wantong Intelligent Control has a strong willingness to collaborate and hopes to open a second growth curve; third, Wantong Intelligent Control has passed automotive certification, and its PCBA capacity is abundant, making collaboration smoother.
In July of this year, Wantong Intelligent Control signed an exclusive sales and cooperation contract in the field of embodied intelligence with Deep Ming Aosi. According to the contract, Deep Ming Aosi authorized Wantong Intelligent Control to produce and sell boards based on Deep Ming Aosi’s large model chip Fellow 1 in the field of embodied intelligence, with a global exclusive authorization period set for five years. Deep Ming Aosi will provide technical support for the cooperation project, including but not limited to: underlying software code based on Deep Ming Aosi’s large model chip Fellow 1 and board hardware design source code.
New Product Technology
OmniVision Group Releases Millimeter Wave Radar System-Level Power Solution
Recently, OmniVision Group released the first domestic automotive Millimeter Wave (MMW) Radar Power Solution that integrates CAN PHY and supports functional safety ASIL B.
The millimeter wave radar system power solution provided by OmniVision Group includes the System Base Chip (SBC) OKX1010/OKX1100 and the low-voltage power chip (PMIC) ORX0211, which serve as primary and secondary power supplies for the system, respectively. The SBC integrates CAN PHY and intelligent communication interfaces SPI/I2C, saving system costs, reducing board space, and accelerating user development cycles.
Features include integrated high-speed CAN PHY, supporting 5M communication rates; support for specific frame wake-up and CAN signal ringing suppression, ensuring high-speed and stable operation of CAN communication. Integrated SPI/I2C intelligent communication interfaces enhance interaction between SOC and PMIC. Integrated pin addressing function saves system BOM costs. Integrated watchdog supports response/cycle window feeding, enhancing system safety.
High flexibility, OKX1010/OKX1100 can be paired with different secondary power supplies to adapt to corner radar or cabin radar, providing high application flexibility.
Xiangdi’s new generation ‘Fuxi’ architecture chip completes tape-out verification
On September 3, Anfu Technology stated on the interactive platform that the new generation ‘Fuxi’ architecture chip developed by Xiangdi has completed tape-out verification, demonstrating excellent performance in graphics rendering and parallel computing.
It is reported that after receiving investment from Anfu Technology, Xiangdi has accelerated its product iteration, with the new generation Fuxi architecture GPU adopting a 5nm process, achieving a computing power of 160 TFLOPS (FP32) and integrating 12GB of HBM2 video memory.
In mid-April of this year, as a shareholder of Xiangdi, Anfu Technology revealed the latest progress of Xiangdi on the interactive platform, stating that the new generation ‘Fuxi’ architecture chip is currently in tape-out, and this architecture will bring two new products, both of which meet leading domestic performance and technical specifications. Fuxi A0 focuses on filling the gap in domestic high-end rendering products; Fuxi B0 is a chip that integrates GPU and NPU, targeting edge model deployment and the rapidly emerging AIPC market, with Fuxi B0 fully supporting the edge deployment needs of mainstream models such as LLAMA, ChatGLM-6B, Stable-Diffusion, Sora, and DeepSeek R1 1.5B/7B.
Anfu Technology also revealed that Xiangdi’s shareholders include investment institutions with state-owned backgrounds, such as Chongqing Liangjiang Industrial Development Group. The listing plan for Xiangdi will be decided based on market conditions, development strategies, and other factors. The company will continue to monitor Xiangdi’s development dynamics and actively support its growth.
Investment and Financing
Xizhi Technology Completes Over 1.5 Billion C Round Financing
Recently, Xizhi Technology, a global leader in optoelectronic hybrid computing power, announced the completion of a C round financing exceeding 1.5 billion yuan. This round of financing attracted participation from well-known investment institutions such as China Mobile, Shanghai Guotou, Guoxin Fund, and Pudong Venture Capital, while existing shareholders such as Zhongke Chuangxing, Yijing Capital, and a leading internet company also increased their investments. As the only unicorn enterprise in China focused on the optoelectronic hybrid computing power field, Xizhi Technology will use this round of financing as an opportunity to further solidify its leading position in the global market.
Since its establishment, Xizhi Technology has aimed to “break the boundaries of computing power through optoelectronic integration,” focusing on two major business directions: photonic networks and photonic computing, adhering to a user demand-oriented approach and continuously promoting the industrial application of optoelectronic hybrid technology from R&D to commercialization.
In the photonic network field, the company launched the world’s first distributed optical interconnect optical switching GPU super node—LightSphere X—during the 2025 WAIC; additionally, Xizhi Technology also announced the latest progress in advanced optical directions, launching the first domestic xPU-CPO optoelectronic co-packaged prototype system and actively developing higher integration and larger bandwidth density CPO solutions. This series of achievements will effectively break through the bandwidth and latency bottlenecks in current large-scale computing clusters and mark the initiation of the company’s photonic network business flywheel.
In the photonic computing field, in March of this year, the company released the latest generation of optoelectronic hybrid computing card Xizhi Tian Shu, integrating the world’s largest scale of 128×128 photonic matrix, achieving the application of optoelectronic hybrid computing in complex commercial models for the first time.
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