Cleanroom Requirements for Chip Packaging and Testing Areas

  The cleanliness requirements for chip packaging and testing areas vary based on specific process steps and product characteristics, typically ranging from ISO Class 5 (100-level) to ISO Class 7 (10,000-level). Below are the cleanliness level classifications and criteria for different areas; let’s explore this together with Hejie Technology Cleanroom Engineering Company!

Cleanroom Requirements for Chip Packaging and Testing Areas

1. Cleanliness Requirements for Core Packaging Areas

ISO Class 5 (100-level)

  Applicable Steps: High-precision packaging (such as flip chip, wafer-level packaging), photolithography areas.

  Particle Control: 0.5μm particles ≤ 3,520 particles/m³ (or ≤ 100 particles per cubic foot).

  Airflow Organization: Unidirectional flow (laminar flow) design, airspeed 0.3-0.5 m/s.

Cleanroom Requirements for Chip Packaging and Testing Areas

ISO Class 6 (1,000-level)

  Applicable Steps: Standard packaging (such as wire bonding), testing areas.

  Particle Control: 0.5μm particles ≤ 35,200 particles/m³ (or ≤ 1,000 particles per cubic foot).

ISO Class 7 (10,000-level)

  Applicable Steps: Back-end packaging (such as molding, cutting), packaging areas.

  Particle Control: 0.5μm particles ≤ 352,000 particles/m³ (or ≤ 10,000 particles per cubic foot).

Cleanroom Requirements for Chip Packaging and Testing Areas

 2. Cleanliness Requirements for Other Auxiliary Areas

  Material Storage Area: ISO Class 8 (100,000-level).

  Changing Rooms/Buffer Zones: ISO Class 7-8.

  General Corridors/Office Areas: No cleanliness requirements, only need comfortable air conditioning.

3. Basis for Cleanliness Levels

  International Standards: ISO 14644-1 (based on the number of 0.1μm/0.5μm particles).

  Industry Standards: SEMI standards (such as SEMI F72).

  Process Requirements: High-precision packaging (such as 3D IC) requires higher cleanliness.

Cleanroom Requirements for Chip Packaging and Testing Areas

4. Key Control Measures

  Air Filtration: HEPA/ULPA filters (100-level areas must have ≥99.99% filtration efficiency).

  Pressure Differential Control: Pressure differential between adjacent areas ≥5Pa to prevent contamination spread.

  Static Electricity Protection: Anti-static flooring (resistance 10⁴-10⁹Ω), ion blowers.

Cleanroom Requirements for Chip Packaging and Testing Areas

  The cleanliness of the chip packaging and testing area should be flexibly adjusted based on process sensitivity and product requirements, typically with the core area at ISO Class 5-6 and the auxiliary area at ISO Class 7-8. The specific levels should be determined in conjunction with the ISO 14644 standard and actual production needs.

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