Performance Comparison Analysis of Qualcomm’s High-End Chips QC6490/610/6125/5430

1. Product Overview and Positioning

The Qualcomm QCS series includes four high-end chips (QCS6490, QCS610, QCS6125, QCS5430) aimed at industrial IoT, edge computing, smart cameras, and other scenarios, with significant differentiated features:

For detailed charts, please click to enlarge

Performance Comparison Analysis of Qualcomm's High-End Chips QC6490/610/6125/5430

For detailed charts, please click to enlarge

  • High-end Performance: QCS6490

  • Long-term Cost-Effectiveness: QCS610/QCS5430

  • Basic Imaging Solution: QCS6125

2. Core Highlights of Each Chip

1. QCS6490: High-end chip, benchmark for AI and multimedia

  • Computing Power Configuration

  • CPU: Kryo 670 Octa-core (Arm v8 architecture)

  • GPU: Adreno 643 (supports 144Hz high refresh rate)

  • AI: 12 TOPS INT8, integrated accelerator architecture

  • Multimedia and Display

  • Three ISP supports 64MP@30fps ZSL shooting + 192MP static shooting

  • 4K30 video encoding/decoding, Adreno 633 VPU enhances image quality

  • Dual screen 2520*1080@144Hz, HDR10+/wide color gamut

  • Expandability

  • PCIe Gen3, USB3.2, UFS 2.1 Gear4

  • Supports five 4-lane CSI camera inputs

  • System Compatibility

Full platform support for Android/Linux/Ubuntu/Windows 11 IoT, lifecycle until 2036

2. QCS5430: Peak AI performance, optimal for edge computing

  • AI Architecture Innovation

  • Sixth-generation AI engine: HTA+HVX+shared memory, peak 13 TOPS

  • Supports concurrent five visual sensor inputs, edge-cloud collaborative processing

  • Hardware Upgrade Space

  • Expandable CPU/GPU/AI performance, supports peripheral expansion

  • Low latency optimization, suitable for industrial automation and real-time response scenarios

  • Display and Connectivity

  • Dual screen 120Hz adaptive refresh rate

  • 2*2 Wi-Fi 6 (802.11ax)

  • Lifecycle: Long-term support until 2032

3. QCS610: Balanced mid-range, long-term cost-effective choice

Energy Efficiency Design

  • 11nm FinFET process, low-power sensor core

  • Kryo 460 Octa-core (4 performance cores + 4 efficiency cores)

AI and Imaging

  • Dual 14-bit ISP, dual camera 16MP or single camera 24MP@30fps

  • Hexagon DSP+HVX, 1.1GHz DNN acceleration

Connectivity

  • 1*1 Wi-Fi 5 (802.11ac), X12 LTE (600Mbps)

  • Applicable scenarios: Basic industrial equipment, security cameras, supported until 2030

4. QCS6125: Entry-level imaging solution

Core Configuration

  • Kryo 260 Octa-core (11nm process)

  • Adreno 610 GPU (Vulkan 1.1 low-power rendering)

Image Enhancement

  • Triple camera support (telephoto/wide/ultra-wide), 48MP snapshot mode

  • Hybrid focus, zero-lag shooting, multi-frame noise reduction

Audio-Visual Experience

  • aptX HD audio + Aqstic technology

  • Single screen 1080P@60Hz display

Positioning: Lightweight smart terminals (e.g., advertising screens, basic monitoring)

3. Key Parameter Comparison

Performance Comparison Analysis of Qualcomm's High-End Chips QC6490/610/6125/5430

4. Recommended Application Scenarios

  • 1. Industrial Automation/XR Devices → QCS6490 (High computing power + multi-system compatibility)

  • 2. Edge AI Boxes/Smart Security → QCS5430 (Multi-sensor access + low latency)

  • 3. Commercial Display Terminals/Basic Monitoring → QCS610/QCS6125 (Long-term + cost optimization)

The four Qualcomm chips precisely cover enterprise-level needs through AI performance stratification and lifecycle management:

Choose QCS6490 for extreme performance, select QCS5430 for AI edge computing;

In budget-constrained scenarios, weigh imaging needs between QCS610 and QCS6125.

Technical Decision Recommendations:

Comprehensively assess based on device iteration cycles, AI load intensity, and long-term maintenance costs.

The above analysis can serve as a quick reference guide for enterprise selection. For in-depth parameter comparisons or customized solutions, please contact us.

Custom development of DDR and UFS testing projects for various platforms based on MTK pop technology

Dimensity 9400 is MT6991,Dimensity 9300 is MT6989

Dimensity 9200 is MT6985,Dimensity 9000 is MT6983

Dimensity 8400 is MT6899,Dimensity 8300 is MT68977

Dimensity 1200 is MT6893,Dimensity 7300 is MT6878

Dimensity 900 is MT6877

Performance Comparison Analysis of Qualcomm's High-End Chips QC6490/610/6125/5430Custom development of DDR and UFS testing projects for various platforms based on MTK Dimensity 9400/8300/9000/9200/9300 PoP technologyDimensity 9400/9300/9200/9000/8300/900/800/720/700/MT6771/MT6765/ etc. customizationRK3576 (8-core 2.3G/6T + supports HDMI/MIPI/EDP multi-screen display + Android/Linux+QT) LGA soldered core boardSelected Articles

  • Performance Comparison Analysis of Qualcomm’s Flagship Chips SM8750P/8650P/QCS8550/8550/8250

  • MediaTek Dimensity 9400 VS Qualcomm Snapdragon 8gen4 SM8750/SM8750P Android Chip Comparison

  • Latest Tariff — Analysis of the Impact of International Brands like TI/ADI/MAXIM/MOLEX on Chinese Supply Prices

  • Under a 104% Tariff Environment, the Opportunities and Challenges for the Domestic Semiconductor Industry

  • Performance Comparison Analysis of MediaTek Dimensity Mid-range Series MT6897/MT6983/MT6878/MT6877

  • Insights | Performance AI Comparison Analysis of Hisilicon IPC Processors hi3403V100/Hi3516DV500/CV610

  • Comprehensive Comparison of RV1106/RV1109/RV1126/SSC8629 and RK3588S Chips

  • Performance Comparison Analysis of MediaTek Dimensity Flagship Series MT6991/MT6989/MT6985/MT6983

  • Comprehensive List of MediaTek (MTK) 4G/5G Platforms and Corresponding CPU Models + MT6899

Solution Recommendations

  • Rockchip RK3588 Core Board (6T computing power NPU/Android/Linux+QT/Ubuntu system)

  • Hisilicon hi3519dv500+imx327/385/335/415/334/585/sc450ai/Os08a20 Development Board

  • Hisilicon Hi3403/SS928/SD3403/21AP10 (Core Board + Base Board) Maximum 10.4T Dual 8MP Input AI Development Board

  • Hi3516DV500 4 million 1/1.8 CMOS 50+38 Dual Board Module

  • MT6877 5G Smart + Rugged 5.6-inch PDA (customizable private model) in stock

  • MT6877 (Dimensity 900: android12/2.0T/UFS2.2/maximum 12G+256G) 5G Core Board/Development Board

  • MTK 5G-MT6853 (Dimensity 720) Core Board/Development Board/

  • MT6785 (G95 12nm/A76*2+A55*6/FHD+(2520*1080)/1T) Android 13 4G AI Module

Related posts

  1. Chip Manufacturing: FEOL, MEOL, and BEOL (Part 2)
  2. Is High-Performance Computing (HPC) the Same as Server Virtualization?
  3. How to Achieve SoC Design Upgrade with USB4
  4. Research on the Autonomous Driving Chip Industry: Central Computing, Large Models, and Navigation Assistance Leading a New Wave of Innovation
  5. In-Depth Understanding of GPU, FPGA, and ASIC
  6. Comprehensive Overview of ROM, RAM, and FLASH
  7. Expert Insights | NXP S32K3 Software Installation and Environment Setup Guide: S32DS Edition
  8. MediaTek Dimensity 8200 Benchmark Scores Released
  9. Essential Knowledge for Buying a New TV
  10. What to Do When Wi-Fi Is Getting Slower?
  11. How Oscilloscopes Generate Positive and Negative Pulses with Varying Widths
  12. Virtualized Kill Chain: The Technological and Tactical Evolution of the U.S. Military’s Anti-Kill Chain Operations in the South China Sea
  13. Understanding Quantum Algorithms: How They Break Modern Encryption Algorithms
  14. The Six Core Companies in Intelligent Computing and Chip Manufacturing Equipment
  15. In-Depth Analysis of Apache HttpClient: A Powerful Tool for Java Network Programming
  16. Symmetric Encryption Algorithms in Blockchain (AES, DES, 3DES, RC4, etc.)
  17. [MalDev-17] Custom Encryption Algorithms and Elliptic Curves
  18. Volkswagen Magotan Audio Upgrade: DSP X16Pro Delivers Exceptional Sound Quality

Leave a Comment