Cleanroom Requirements for Chip Packaging and Testing Areas

Cleanroom Requirements for Chip Packaging and Testing Areas

  The cleanliness requirements for chip packaging and testing areas vary based on specific process steps and product characteristics, typically ranging from ISO Class 5 (100-level) to ISO Class 7 (10,000-level). Below are the cleanliness level classifications and criteria for different areas; let’s explore this together with Hejie Technology Cleanroom Engineering Company! 1. Cleanliness Requirements for … Read more