Automotive Semiconductor Industry Outlook: How NXP, Infineon, and ST Lead the Transformation of the Automotive Ecosystem? (Complete Report Included)

– “SysPro Power Electronics Technology” High-Level Growth Knowledge Planet Content– Column: Semiconductor Industry News Interpretation– Analysis of NXP, Infineon, and ST Annual Summit Reports– Original article, for internal use only by SysPro

– This is an excerpt; the complete content and report are published on the Knowledge Planet. Welcome to learn and exchange.

Introduction: With the rapid development of technology, the transformation of the automotive industry has become a global focus. From the proliferation ofAdvanced Driver Assistance Systems (ADAS) andAutonomous Driving (AD) to the promotion ofElectric Vehicles (xEV) andSoftware-Defined Vehicles (SDV), the automotive industry is undergoing an unprecedented transformation. In this process,semiconductor technology plays a crucial role. This article will delve into the reports from companies likeNXP, Infineon, and ST at the 2024 Investor Summit, exploring thefuture trends,technological innovations, and the strategic layouts of these semiconductor leaders, looking ahead to the direction of automotive ecosystem transformation.01

NXP: The Future of the Automotive Industry and NXP’s Innovative Leadership

At theNXP 2024 Investor Summit, a detailed report revealed the macro trends facing the automotive industry, the complexity management needs of automotive manufacturers, and NXP’s core role as a key thought leader in driving the transformation of the automotive ecosystem. This article will deeply interpret this report, exploring itslogic, hierarchy, and depth to draw insights.

Image Source: NXP1. Macro Trends in the Automotive Industry: Driving Content Growth

The report begins by stating that by 2030, the penetration rates ofADAS/AD (Advanced Driver Assistance Systems/Autonomous Driving), xEV (Electric Vehicles), and SDV (Software-Defined Vehicles) will exceed60%, 70%, and 65%, respectively. These trends not only indicate technological innovation in the automotive industry but also drive mid to high single-digit growth in automotive content. The proliferation of ADAS/AD will enhancedriving safety and comfort, while the promotion ofxEV will accelerate theelectrification process of the automotive industry, and the rise ofSDV will fundamentally changethe R&D and production models of automotive manufacturers.

Image Source: NXP2. Complexity Management Needs of Automotive Manufacturers

With continuous technological advancements,automotive manufacturers face unprecedentedsoftware complexity and legacy system complexity. The report points out that to effectively manage this complexity, automotive manufacturers need to adopt aservice-oriented architecture. This architecture views the vehicle asa system composed of multiple services, each of which can beindependently developed, deployed, and managed. Through this approach, automotive manufacturers can respond more flexibly to market changes and technological innovations.

Image Source: NXP

3. NXP’s Three Strategic Pillars: Innovation Leadership

In the face of the automotive industry’s transformation, NXP has proposedthree strategic pillars: innovation leadership, system solutions, and partnerships. Among them, innovation leadership is NXP’s core competitiveness. In areas such as automotive safety access, in-vehicle radio/audio, and radar, NXP maintains a technological leadership position and closely collaborates with automotive manufacturers to jointly promote technological innovation and development.

Image Source: NXP

4. NXP Automotive System Solutions: Focus on Core Vehicle Functions

NXP’s automotive system solutions focus on core vehicle functions such ashard safety boundary protection and high-performance vehicle processing platforms. These solutions not only ensure the safety and robustness of vehicles but also provide automotive manufacturers with efficient and reliable technical support. In particular,NXP’s CoreRide platform providessystem-level verification from development to production, supporting variouselectronic/electrical architectures, and providing strong assurance for the deployment of software-defined vehicles.

Image Source: NXP

Image Source: NXP

5. Leading Cases of NXP System Solutions

The report lists several leading cases of NXP system solutions, includingS32N vehicle computing platform, radar solutions, and battery management systems. The S32N, as the first automotive-grade5nm processor, integrates all SDV functions, providing a safe and efficient solution. NXP’s radar platform and battery management systems have also gained favor from many automotive manufacturers due to their high performance and scalability.

Image Source: NXP

6. NXP as a Key Thought Leader in Transforming the Automotive Ecosystem

As a key thought leader in transforming the automotive ecosystem,NXP collaborates with multiple partners to jointly promote theinnovation and development of automotive technology. Through open cooperation and resource sharing, NXP not only accelerates the R&D and application of new technologies but also provides automotive manufacturers withmore comprehensive and efficient technical support and services.

Image Source: NXP

Image Source: NXP

7. Insights and Outlook

From this report, we can draw many insights. First, the future of the automotive industry will be technology-driven, with trends such asADAS/AD, xEV, and SDV leading the direction of industry development. Second, automotive manufacturers need to adoptmore flexible and efficient management models to respond to technological innovations and market changes. Finally, as a leader in technological innovation, NXP will continue to play a key role in promotingthe transformation of the automotive ecosystem, providing automotive manufacturers with more comprehensive and efficient technical support and services.

Image Source: NXP

| SysPro Note: The complete report has been uploaded to the Knowledge Planet, welcome to download and review (click “Read the original text” at the end of the article):

Image Source: “SysPro Power Electronics Technology” Planet

02

Infineon: Focus on Innovation and Development in the Automotive Field

Infineon Technologies held a roadshow for its automotive-related business on December 4 in London, showcasing itsdeep foundation and forward-looking layout in the automotive semiconductor field. Since 2019, Infineon has consistently ranked first among automotive semiconductor suppliers, maintaining a leading position inpower semiconductors, microcontrollers (MCUs), sensors, and Flash across multiple key areas.

Image Source: Infineon

1. Outstanding Performance in the Chinese Market

In the Chinese market, Infineon’s performance is particularly impressive. Since 2017, Infineon has held the top position in the Chinese automotive semiconductor market, with its market share steadily increasing. Aselectric vehicles, software-defined vehicles, anddriving experience have gained increasing attention, despite the overall slowdown in automotive sales growth, the value of automotive chips continues to rise, with Infineon leading this trend.

Image Source: Infineon

2. Breakthroughs in Technological Innovation

In terms of technological innovation, Infineon has made breakthroughs insilicon, silicon carbide (SiC), and gallium nitride (GaN) processes. Infineon has launched theworld’s thinnest silicon power wafers, significantly improving energy efficiency; at the same time, it has also achieved significant results in the production of8-inch SiC wafers and 12-inch GaN wafers. For different power requirements, Infineon has also introducedSiC/Si hybrid modules, which reduce costs while optimizing the range of electric vehicles.

Image Source: Infineon

Image Source: Infineon

Image Source: Infineon

3. Key Elements of Software-Defined Vehicles In response to the development trend ofsoftware-defined vehicles, Infineon emphasizes several key elements, includingfunctional safety and information security,high-speed in-vehicle networks, and intelligent power distribution. Infineon particularly points out that software-defined vehicles not only requireimproved processing performance but also have higher requirements fordecoupling application software and hardware,managing complex real-time communication performance, andASIL-C and ASIL-D level failure safety.

Image Source: Infineon

4. Wide Application of Power Semiconductor Technology

In terms ofpower semiconductors, Infineon’sPROFET Wire Guard technology can be widely applied inload state diagnostics, eFuse, and solid-state relays, providing smarter and more reliable power management solutions for software-defined vehicles. Additionally, as the power consumption of various functional domains in vehicles continues to increase,48V systems have gradually become an industry consensus. Infineon has already applied80 products in 48V systems, coveringpower devices for power supply, motor drives, protective power devices, and battery management across multiple fields.

Image Source: Infineon

5. Broad Application Prospects of Gallium Nitride

Infineon is also confident about the application prospects ofgallium nitride. In addition to applications inon-board chargers (OBC) and DC-DC converters, Infineon believes that gallium nitride also has huge application potential intraction inverters. This is also one of the important reasons for Infineon’s acquisition ofGaN Systems, aimed at further consolidating its leading position in gallium nitride technology.

Image Source: Infineon

6. Microcontrollers Supporting the Intelligent Upgrade of Vehicles

In terms ofmicrocontrollers, Infineon’sAURIX TC4x series, with its excellent performance and safety, has become the preferred solution forregional architecture topologies. With the addition ofPPU (Parallel Processing Unit), AURIX TC4x can also provideAI support, providing strong assurance for the intelligent upgrade of vehicles.

Image Source: Infineon

| SysPro Note: The complete report has been uploaded to the Knowledge Planet, welcome to download and review (click “Read the original text” at the end of the article):

Image Source: “SysPro Power Electronics Technology” Planet

03

ST: Automotive Semiconductor Layout and Future Outlook

1. Market Position and Future Outlook

On November 20,STMicroelectronics (ST) held an investor summit, which covered several important topics in the automotive field. According to TechInsights statistics, ST holds a leading position in several power device markets, such assmart power switches (40% market share),braking systems (50%),silicon MOSFETs (9%),power chains for fuel vehicles (30%),silicon carbide MOSFETs + modules (40%), andIGBTs (8%). Benefiting from the trends of automotive electrification and intelligence, it is expected that the automotive semiconductor market will grow to $138.3 billion by 2030, significantly up from the current market size of $76.3 billion.

Image Source: ST

2. Trends in Automotive Technology DevelopmentThe trends in automotive technology development are summarized assafer, more connected, and greener, covering various technologies such as intelligent lighting, braking systems, software-defined vehicles, regional control architecture, autonomous driving, 48V systems, electrification, sensors, safety, and in-vehicle network connectivity.3. Power Business Layout and Strategy

In terms ofpower business, ST has launched a“China for China” strategy, particularly achieving vertical integration and regional supply in the silicon carbide field to meet customer demands for manufacturing origin. In 2023, ST partnered with Chinese mainland company Sanan Optoelectronics to establish a joint venture wafer manufacturing plant in Chongqing, focusing on the production of 8-inch silicon carbide chips. At the same time, ST is also collaborating with Huahong to localize the manufacturing of 40nm process MCUs.

Image Source: ST

Silicon Carbide Technology:ST is developingfifth-generation silicon carbide technology, adopting a new scalable, innovative, and efficient integration approach. By comparingmonolithic design and chiplet design systems, it highlights the advantages of chiplet technology in optimizing the cost, wafer cost, performance, and time-to-market of each functional module. Chiplet technology achieves high reliability and high performance through heterogeneous integration technologies such as fan-in/fan-out and direct copper interconnects, as well as utilizingpanel-level package (PLP) technology with front-end and back-end substrate capabilities.

Image Source: ST

ST is committed to promotingthe continuous advancement and innovation of electronic packaging technology, categorizing different packaging technologies, includingpower modules, power discrete devices, lead frame packaging, laminated packaging, chip size packaging (CSP), and sensor packaging. Each packaging technology demonstrates its key features and objectives, such asincreasing power density, reliability, cooling efficiency, heterogeneous integration, developing towards chip platforms, improving interconnect density, and miniaturization accuracy.

Image Source: ST

4. 48V Systems and Inverter, OBC/BMS Layout

48V systems help reduce wiring harnesses and power losses, which is particularly important for pure electric vehicles. ST provides a comprehensive line of analog, mixed-signal, and power products to support this trend. In terms of inverters andOBC/BMS, ST’s product layout covers the entire signal chain and power-related fields.

Image Source: ST

5. ASIC/ASSP and Braking System Technology

ST supplies various categories ofASIC or ASSP, includingBMS, traction, braking, airbags, door control, engines, and PMIC, and ranks among the leaders in the markets for braking, door control, and driving. Future vehicles will adopt four independent wheel control units to enhance safety, maneuverability, and convenience.

Image Source: ST

6. Growth of Sensor Business and Product Line

In terms ofsensors, ST expects an annual growth rate of over 10%. The products offered by the company includeIMUs for body stability control, IMUs for navigation, accelerometers for automotive anti-theft, and image sensors for driver monitoring.

Image Source: ST

7. MCU R&D and Challenges of Regional Control Architecture

In terms of MCUs, ST is actively addressing the challenges ofregional control architecture and strengthening the R&D of automotive MCUs.

• New Product Launches: Stellar P series multi-in-one and Stellar G series switch applications.
• Phase Change Memory Technology: emphasizes its advantages in MCUs, such as higher density and stronger anti-interference.
• Classic STM32 Series: will enter the automotive field, focusing on ASIL-B level applications for various actuators and nodes.

Image Source: ST

| SysPro Note: The complete report has been uploaded to the Knowledge Planet, welcome to download and review (click “Read the original text” at the end of the article):

Image Source: “SysPro Power Electronics Technology” Planet

The above content is an excerpt from“In-Depth Analysis of NXP, Infineon, and ST Annual Summit Reports”, the complete report has been integrated and published in the Knowledge Planet “SysPro Power Electronics Technology” (EE), welcome for further review and learning, hope it helps!

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