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According to news from China State Construction Engineering Corporation, on June 26, the first equipment for the 8-inch silicon carbide power device chip manufacturing line project (Phase I) of Xiamen Silan Microelectronics was moved in ahead of schedule. This project is a key construction project for Fujian Province and Xiamen City in 2025, and it is also Xiamen’s largest silicon carbide project.
It is reported that the total investment for this project is 12 billion yuan, divided into two phases. Upon completion, it will have an annual production capacity of 720,000 pieces of 8-inch silicon carbide power device chips. The first phase of the project has a total investment of 7 billion yuan, with preliminary production expected by the end of the third quarter of 2025 and trial production in the fourth quarter of 2025, reaching an annual output of 420,000 pieces after full production. The completion of this project will greatly enhance Silan Micro’s silicon carbide chip manufacturing capacity, effectively meeting the domestic demand for silicon carbide chips in new energy vehicles, and will also be capable of providing high-performance silicon carbide chips for photovoltaic, energy storage, and charging pile power inverter products.
According to data, Silan Micro is one of the major integrated semiconductor design and manufacturing (IDM) enterprises in China. The company was established in 1997 and was listed on the Shanghai Stock Exchange in March 2003. For many years, it has focused on the design, manufacturing, and packaging of silicon semiconductor and compound semiconductor products, ranking among the top in the industry in terms of technology level, business scale, and profitability.
8-inch silicon carbide is becoming the focus of competition in the third-generation semiconductor industry. Compared to 6-inch wafers, the area is 1.83 times larger, significantly increasing the output of single-chip devices, reducing costs by more than 30%, and providing better uniformity in process parameters. Major international companies such as Infineon, STMicroelectronics, and Wolfspeed are accelerating their layouts, with ON Semiconductor’s factory in Bucheon, South Korea, and Infineon’s factory in Kulim, Malaysia, expected to start mass production in 2025. Domestic companies such as Sanan Optoelectronics and Tianyue Advanced have also made breakthroughs, with Sanan’s Chongqing project achieving substrate factory lighting and Tianyue Advanced’s 8-inch conductive substrates entering the stage of mass production. With the growing demand in the fields of new energy vehicles and photovoltaics, 8-inch silicon carbide is expected to accelerate the replacement of 6-inch products.
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